-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs
October 12, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.
Opening day speakers included keynotes from Tech Search’s Jan Vardaman, and Intel’s Tom Rucker. Additional speakers throughout the day represented DoD, NIST, the European Union, Western Digital, IBM, AMD, Northrup Grumman, and BAE Systems.
IPC organized this symposium so that executives, government, and industry leaders could meet in person and share insights. The discussion was intended to identify key business and technology issues with near- and longer-term solutions. The purpose was focused on opportunities and challenges for next-generation advanced packaging production. The top-down agenda covers public policy updates, commercial and defense electronics technology drivers, current business environment for IC-substrates and component assembly and test manufacturing.
Figure 1: John Mitchell, president and CEO of IPC, addresses the crowd during a morning session at the IPC Advanced Packaging Symposium.
Vardaman laid the market groundwork in an early presentation Tuesday, pointing out that there is effectively no packaging capability in North America, forcing all semiconductors to be packaged in Asia; a theme that many of the speakers would return to throughout the day. Likewise, Vardaman pointed out the lack of substrate capabilities outside of Asia, setting up another capability gap that was addressed by nearly every speaker throughout the day: Investment in advanced packaging techniques is a critical manufacturing capability not only for U.S. and EU military needs, but also for supply chain resilience.
The CHIPS Act was a key area of discussion. During his presentation, Frank Gayle of NIST asserted that packaging and PCB manufacturing investment programs would be considered as appropriate to submit under the CHIPS Act. This seemed to be news to several attendees I spoke with, and if true, certainly leaves the door open for wider CHIPS Act investment throughout the supply chain.
Each speaker, in their own way, made the argument that the U.S. and EU need to ramp up these capabilities. During her Q&A session, Kim Eilert of BAE Systems was asked when BAE would need to have this capability available to them. Her answer was, “Today.” It was clear that she meant that quite literally.
Wednesday’s agenda includes a welcome from IPC Chief Technologist Matt Kelly, who will also moderate a panel discussion on the North American perspective on the IC substrate market. Other speakers will provide insights on the history of the package substrate industry, how the U.S. can gain a foothold in this market, where the technologies are at, and next steps.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/17/2024 | Andy Shaughnessy, Design007 MagazineThis week, trade shows are at the top of our feed, with our coverage of the Del Mar Electronics and Manufacturing Show and IPC APEX EXPO. These two longtime events are almost polar opposites in size and scope, but Del Mar seems to be expanding from its roots as a “neighborhood gathering” with its move into the Del Mar Fairgrounds. The Del Mar show always has a good “buzz factor,” which is something you can’t buy.
IPC APEX EXPO: Some Thoughts About Growth
05/16/2024 | Dan Feinberg, I-Connect007After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
IPC Raymond E. Pritchard Hall of Fame Award: Pierre-Jean Albrieux
05/10/2024 | Marcy LaRont, PCB007 MagazineCongratulations to Pierre-Jean Albrieux, who received the 2024 IPC Raymond E. Pritchard Hall of Fame Award. The award is given to individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and toward the advancement of the industry, including helping to create a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of IPC.
IPC Focuses on Education and Onboarding
05/09/2024 | Andy Shaughnessy, Design007 MagazineI recently spoke with Carlos Plaza, senior director of education for IPC, about expanding educational efforts in the PCB design, fabrication, and assembly segments. As Carlos explains, PCB design is a hot topic, but onboarding may be the hottest one of all.
Real Time with… IPC APEX EXPO 2024: Industry Growth, Challenges, and Technological Advancements
05/09/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Shawn DuBravac, IPC chief economist, dive into key industry topics such as growth, challenges, and technological advancements. They discuss shifts in the global competitive landscape, downstream demand, customization, and how AI is enhancing human skills. The industry outlook appears promising for both the short and long term.