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October Issue of PCB007 Magazine Available Now
October 17, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

The PCB imaging process has evolved quite a bit over the last six or seven decades, from screening to liquid photoresist to dry film and then to aqueous dry film. Now laser direct imaging has created a world of possibilities that were unthinkable with film.
Of all of the process steps in a fabrication cycle, imaging may be the most critical. There are many variables to deal with in imaging, making best practices of solid data collection and analysis a must.
In the October issue of PCB007 Magazine, our experts discuss ways for the readers to fine-tune their imaging process by understanding how etching, plating, and imaging all work together.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
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Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.