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From Dilution to ZLD: Optimizing Used Process Water Management

06/10/2026 | Richard Nichols, GreenSource Engineering
Last month, we began discussing the journey from dilution to zero liquid discharge. I highlighted that approximately 70% of the used process water (UPW) is generated from the dilute stream. This significant volume underscores the necessity for effective treatment processes that ensure the safe return of water into the production cycle while minimising environmental impact.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Seeing a Problem, Building a Solution: The ChipHub Story

06/05/2026 | Global Electronics Association
After more than three decades in the hardware industry, Aftab Farooqi knew one thing for certain: the way companies source semiconductors and components wasn’t working as well as it could. “I spent years at companies like Google and Amazon working in semiconductor sourcing,” he explains. “We were evaluating hundreds of thousands of components, with billions of dollars in spend, but the process was still incredibly manual and inefficient.”

Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?
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