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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Seika Offers McDry Cabinets with Data Loggers
October 21, 2022 | Seika MachineryEstimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to offer McDry cabinets with Data Loggers as an option. Secure, cloud-based data storage, and multiple unit monitoring are just a few features of the Data Loggers.
By adding a Data Logger to McDry cabinets, users can schedule recurring reports right to your inbox. Also, get email, text and phone alerts when temperature or humidity is out of specification. Charts are downloadable as evidence for traceability, and Data Loggers are Ethernet based, Wifi and networking capable.
The McDry high performance dry cabinet maintains one percent RH levels and quickly recovers back to set point 2-3 times faster than previous model. All McDry ultra-low humidity storage cabinets conform to IPC/JEDEC J-STD 033C and IPC 1602 Standards. Additionally, the ESD safe design adheres to the IEC-61340-5-1 (ESD) Standard. McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and nitrogen storage.
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11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle
11/19/2024 | Michelle Te, IPC CommunityWhen I contacted IPC design instructor Kris Moyer to discuss his sustainable lifestyle, he responded to my text with a call. "I'm calling you from about 8,000 feet, sitting at the foot of Mammoth Lakes," he told me. “My friends and I are about to get in the pool for the afternoon." Kris can do this because he actually lives full-time in his travel-trailer at this campground. He's now a permanent camper, taking him anywhere the winds blow—and where there's strong internet service—so he can teach his PCB design classes, offer expert interviews, and live off the land.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.