-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec and Taiyo: The One-Stop Shop for PCB Materials at electronica 2022
October 26, 2022 | Ventec International GroupEstimated reading time: 1 minute

Ventec International Group Co., Ltd., will be exhibiting alongside its partner, Taiyo, at electronica 2022 in Munich. From 15 to 18 November 2022, visitors to the joint Ventec & Taiyo booth #207 in hall A1 will be invited to discover the collaboration’s one-stop shop for PCB material requirements. Attendees can find out more about Ventec’s unique laminate and prepreg capability as well as the additional technologies brought together for the PCB Materials One-Stop Shop. Alongside Ventec’s range and Taiyo’s color-based technology, the one-stop shop offers advanced copper foils, Thinflex FCCLs and coverlays, thermal interface materials from EMI Thermal, aluminum entry drill boards, and more.
Ventec and Taiyo technology experts will be on-hand to share a beer and advise on the following:
- aerolam – The dedicated portfolio developed by Ventec to cater for the complete spectrum of aerospace and defense applications.
- autolam – Ventec’s PCB base material solution set, specifically curated for the diverse and unique requirements of automotive and EV/e-mobility applications.
- tec-speed – Our comprehensive and enhanced set of high-performance, high-reliability high-speed/low-loss/high-frequency solutions.
- tec-thermal – Ventec's IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs that guarantee excellent thermal performance.
- Taiyo inks – Taiyo’s PSR-4000 and PSR-4100 series of two-component, alkaline developable LPI solder mask products, available in a full range of colors.
“Ventec is pleased to return to electronica,” enthused Mark Goodwin, COO EMEA & America at Ventec. “With our new partners Taiyo, we’d like to invite visitors to our booth not just to discuss our world-leading materials and solutions, but to enjoy a unique Ventec or Taiyo burger and some draught beer - after all, we all know just how busy these events can get and sometimes it’s good to just have a chat with colleagues and friends!”
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.