Connect the Dots: Proactive Controlled Impedance
Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Ansys Simulation Helps Accelerate Next-Gen Wireless Communication for Murata Manufacturing
October 28, 2022 | PRNewswireEstimated reading time: 1 minute
As part of a new multiyear agreement, Ansys' industry-leading simulation tools will help Murata Manufacturing Co. develop electronic components for efficient, next-generation wireless communication and mobility products.
Leveraging Ansys' expansive simulation portfolio will help Murata improve the efficiency, performance and quality of its electronic components, which include radio frequency (RF) modules, multilayer resin substrates known as MetroCirc, and multilayer ceramic capacitors (MLCC). These components are essential in expanding high-frequency communications to support new-age connectivity demands while upholding sustainability initiatives.
The new multiyear agreement builds on Ansys' existing relationship with Murata. Ansys HFSS 3D high-frequency electromagnetic simulation software helped enable the development of an efficient direct-current-resonance method for wireless power transfer systems, which have the potential to charge more devices than batteries or wired systems have the capacity to power.
"Murata is leading innovation in wireless connectivity components and working toward a better environment by advancing technology for an Internet of Things (IoT) connected society," said Norio "Nick" Yoshida, general manager of the computer-aided design (CAD)/computer-aided engineering (CAE) department at Murata. "Through this agreement, Ansys' simulation solutions will support our design and development initiatives while enabling us to meet our sustainability goals and help expand our global market."
The team will implement Ansys' electronics system design tools to develop high-frequency devices and communications modules for the future that feature low-power consumption, high-power performance, and improved reliability. With the ability to model phenomena such as electromagnetic interference (EMI), electromagnetic compatibility (EMC), and radio frequency interference (RFI), Ansys tools will help to solve complex and large-scale electronics engineering challenges.
"With wireless networks based on the technology of 5G and beyond, the demands of connectivity modules and components increase significantly," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "Ansys' simulation solutions not only meet today's rising demands but remain ahead of them, and we are confident that Ansys' electronics system design tools will equip Murata to develop the wireless connectivity possibilities of tomorrow."
Share on:
Suggested Items
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.