The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Ansys Simulation Helps Accelerate Next-Gen Wireless Communication for Murata Manufacturing
October 28, 2022 | PRNewswireEstimated reading time: 1 minute
As part of a new multiyear agreement, Ansys' industry-leading simulation tools will help Murata Manufacturing Co. develop electronic components for efficient, next-generation wireless communication and mobility products.
Leveraging Ansys' expansive simulation portfolio will help Murata improve the efficiency, performance and quality of its electronic components, which include radio frequency (RF) modules, multilayer resin substrates known as MetroCirc, and multilayer ceramic capacitors (MLCC). These components are essential in expanding high-frequency communications to support new-age connectivity demands while upholding sustainability initiatives.
The new multiyear agreement builds on Ansys' existing relationship with Murata. Ansys HFSS 3D high-frequency electromagnetic simulation software helped enable the development of an efficient direct-current-resonance method for wireless power transfer systems, which have the potential to charge more devices than batteries or wired systems have the capacity to power.
"Murata is leading innovation in wireless connectivity components and working toward a better environment by advancing technology for an Internet of Things (IoT) connected society," said Norio "Nick" Yoshida, general manager of the computer-aided design (CAD)/computer-aided engineering (CAE) department at Murata. "Through this agreement, Ansys' simulation solutions will support our design and development initiatives while enabling us to meet our sustainability goals and help expand our global market."
The team will implement Ansys' electronics system design tools to develop high-frequency devices and communications modules for the future that feature low-power consumption, high-power performance, and improved reliability. With the ability to model phenomena such as electromagnetic interference (EMI), electromagnetic compatibility (EMC), and radio frequency interference (RFI), Ansys tools will help to solve complex and large-scale electronics engineering challenges.
"With wireless networks based on the technology of 5G and beyond, the demands of connectivity modules and components increase significantly," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "Ansys' simulation solutions not only meet today's rising demands but remain ahead of them, and we are confident that Ansys' electronics system design tools will equip Murata to develop the wireless connectivity possibilities of tomorrow."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
IBM, Dallara to Advance AI and Quantum-Powered Design for High-Performance Vehicles
05/01/2026 | IBMIBM and the Dallara Group, a world-leading racing and high-performance vehicle manufacturer, announced a collaboration to advance vehicle design and optimization using AI and explore the use of quantum computing.