-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Revolutionizing Radar Signal Processing
November 1, 2022 | DARPAEstimated reading time: 1 minute
Radar systems have seen many technology improvements in apertures (antennas) and associated hardware and software since the nascent operational versions in World War II. What hasn’t changed significantly over the decades, however, is that radars still use linear signal processing between the aperture and the detector. In the 1940s linear radar signal processing used vacuum tubes and analog circuits, while current radars accomplish linear signal processing digitally with microchips and software.
With the Beyond Linear Processing (BLiP) program, DARPA’s goal is to improve radar performance by applying innovative signal processing methods. BLiP will leverage high-power computer processing to explore new, non-linear and iterative signal processing techniques that could lead to lighter, smaller, and less expensive – but equally capable – radar systems. If successful, BLiP would enable the same radar performance achieved on large platforms today on much smaller sea, air, and ground platforms.
“A lot of radar improvements over the past 30 years have focused on growing the size of the aperture for greater sensitivity or increasing transmitter power,” said Frank Robey, BLiP program manager in DARPA’s Strategic Technology Office. “Those are important, but if we want to shrink aperture size by 50% and still get the same radar performance then we need to disrupt the linear signal processing paradigm. With the tremendous increases in computer processing power available today, we can take a fresh look at radar signal processing and explore iterative, leap-ahead techniques.”
BLiP will address the current immaturity of non-linear and iterative signal processing methods. Over the course of the two-year program, end-to-end radar signal processing chains will be developed, analyzed, implemented and tested – initially through non-real-time laboratory testing and culminating in real-time implementation and full-scale field testing using an operational National Weather Service radar. Key technical challenges for BLiP will be the development, understanding, and optimization of the signal processing chain, and the practical aspects of implementing BLiP algorithms using real-time, high-performance processing.
Suggested Items
PCB Market Size to Grow by $29.06B from 2024-2028
05/17/2024 | PRNewswireThe global printed circuit board (PCB) market size is estimated to grow by USD 29.06 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.6% during the forecast period.
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
05/14/2024 | BUSINESS WIRESiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation
05/09/2024 | ANSYSAnsys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.