-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
X2F Demonstrates Ground-breaking Molding Technology
November 3, 2022 | X2FEstimated reading time: 2 minutes

X2F is making waves with their breakthrough molding technology, unlocking new manufacturing capabilities for protecting electronics from heat. X2F’s unique technology molds highly filled and extremely viscous materials that are “impossible to mold” with today’s conventional approaches. Their innovative molding process provides a superior solution to potting and conformal coating when extreme thermal management is needed, and it improves thermal performance of the end product by as much as 200%.
Accomplishing the Impossible
Motivated by the tremendous need for high-performance thermally conductive solutions to dissipate heat from electronics used in a variety of industries, X2F developed a patented low-pressure and Controlled Viscosity Molding (CVM) approach. Typical difficult-to-mold materials such as highly filled thermally conductive hot melt adhesives, thermoplastic elastomers, polycarbonates, and nylons are no problem with X2F technology.
High-tech advances in a variety of industries have created electronics with more power and functionality. Today’s electronics require improved cooling methods to prevent overheating and ensure long-term reliable performance. For instance, printed circuit boards (PCBs) used to manage battery power in today’s power tools often develop hot spots during operation. These hot spots reduce the product’s lifespan by degrading battery charging and discharging performance. X2F technology eliminates hot spots via over-molding of electronics with highly filled thermally conductive materials. This type of thermal management is critical to achieving superior performance for today’s advanced electronics, batteries, and LED lighting.
Unique X2F Process
X2F’s technology delivers highly filled materials to the mold cavity via extruders that are designed specifically for X2F’s unique Extrude to Fill (“X2F”) process. The X2F process combines specialized hardware, sensors, software, and a process feedback loop. Utilizing electrically generated heat instead of high-pressure shearing, X2F technology precisely controls the pressure, temperature, and viscosity of the melted material throughout the molding process. And by continuously sensing mold cavity pressure and using their patented “pulse-pack” process, X2F molding can be performed at 70 to 90% lower pressure than traditional injection molding.
Faster Production
The X2F process easily molds highly filled materials at high-volume production speeds. Cycle times of 30 to 60 seconds are common with X2F, which is significantly faster than potting and conformal coating, which can take several hours. Companies can also expect ultra-fast prototyping from X2F – typically 5 to 10 business days for samples depending on the complexity. Their process even includes the ability to provide compounding at the press – adding fillers (ceramics, graphite, etc.) to impart added performance.
Enabling Innovation
In their recent collaboration with Covestro, X2F co-developed a thermally conductive automotive heat-sink with in-mold-electronics that was 49% lighter than traditional cast aluminum. And by eliminating the need for brackets, fasteners, thermal pastes, and adhesives, the X2F process was significantly less expensive. Covestro also saw improvements in thermal performance with the X2F solution compared to traditional injection-molding processes. This illustrates how X2F technology is enabling innovation. With X2F, previously un-moldable materials can be used, new higher-performance materials can be developed, and more intricate molded shapes can be designed.
“This innovative technology is a game-changer for the industry, helping to accelerate innovation and technology for new products with higher performance. Our molding technologies are eliminating barriers with materials everyone thought where impossible to mold. We can now streamline production, reduce manufacturing complexity, and add significant thermal enhancements to products with ever expanding performance requirements.” said Antonio Aceves, VP of Strategy & Business for X2F.
Suggested Items
Creative Electron Strengthens Leadership Team with Strategic Appointments in Marketing and SMT Business Unit
05/08/2025 | Creative ElectronCreative Electron, the largest U.S. manufacturer of X-ray inspection systems for the electronics industry, is proud to announce the addition of two seasoned leaders to its executive team: Wagner Lima as Marketing Director and Giancarlo De La Garza as SMT Business Unit Director.
LG Electronics India Limited Begins Construction of Its Third Manufacturing Plant in India
05/08/2025 | BUSINESS WIRELG Electronics India Ltd. (LGEIL) announced the commencement of construction of its new manufacturing facility in Sri City, Andhra Pradesh today at a ceremony graced by the presence of Shri Nara Lokesh, Hon'ble Minister for Information Technology, Electronics and Communications.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector
05/07/2025 | IPCElectronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.