-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
X2F Demonstrates Ground-breaking Molding Technology
November 3, 2022 | X2FEstimated reading time: 2 minutes
X2F is making waves with their breakthrough molding technology, unlocking new manufacturing capabilities for protecting electronics from heat. X2F’s unique technology molds highly filled and extremely viscous materials that are “impossible to mold” with today’s conventional approaches. Their innovative molding process provides a superior solution to potting and conformal coating when extreme thermal management is needed, and it improves thermal performance of the end product by as much as 200%.
Accomplishing the Impossible
Motivated by the tremendous need for high-performance thermally conductive solutions to dissipate heat from electronics used in a variety of industries, X2F developed a patented low-pressure and Controlled Viscosity Molding (CVM) approach. Typical difficult-to-mold materials such as highly filled thermally conductive hot melt adhesives, thermoplastic elastomers, polycarbonates, and nylons are no problem with X2F technology.
High-tech advances in a variety of industries have created electronics with more power and functionality. Today’s electronics require improved cooling methods to prevent overheating and ensure long-term reliable performance. For instance, printed circuit boards (PCBs) used to manage battery power in today’s power tools often develop hot spots during operation. These hot spots reduce the product’s lifespan by degrading battery charging and discharging performance. X2F technology eliminates hot spots via over-molding of electronics with highly filled thermally conductive materials. This type of thermal management is critical to achieving superior performance for today’s advanced electronics, batteries, and LED lighting.
Unique X2F Process
X2F’s technology delivers highly filled materials to the mold cavity via extruders that are designed specifically for X2F’s unique Extrude to Fill (“X2F”) process. The X2F process combines specialized hardware, sensors, software, and a process feedback loop. Utilizing electrically generated heat instead of high-pressure shearing, X2F technology precisely controls the pressure, temperature, and viscosity of the melted material throughout the molding process. And by continuously sensing mold cavity pressure and using their patented “pulse-pack” process, X2F molding can be performed at 70 to 90% lower pressure than traditional injection molding.
Faster Production
The X2F process easily molds highly filled materials at high-volume production speeds. Cycle times of 30 to 60 seconds are common with X2F, which is significantly faster than potting and conformal coating, which can take several hours. Companies can also expect ultra-fast prototyping from X2F – typically 5 to 10 business days for samples depending on the complexity. Their process even includes the ability to provide compounding at the press – adding fillers (ceramics, graphite, etc.) to impart added performance.
Enabling Innovation
In their recent collaboration with Covestro, X2F co-developed a thermally conductive automotive heat-sink with in-mold-electronics that was 49% lighter than traditional cast aluminum. And by eliminating the need for brackets, fasteners, thermal pastes, and adhesives, the X2F process was significantly less expensive. Covestro also saw improvements in thermal performance with the X2F solution compared to traditional injection-molding processes. This illustrates how X2F technology is enabling innovation. With X2F, previously un-moldable materials can be used, new higher-performance materials can be developed, and more intricate molded shapes can be designed.
“This innovative technology is a game-changer for the industry, helping to accelerate innovation and technology for new products with higher performance. Our molding technologies are eliminating barriers with materials everyone thought where impossible to mold. We can now streamline production, reduce manufacturing complexity, and add significant thermal enhancements to products with ever expanding performance requirements.” said Antonio Aceves, VP of Strategy & Business for X2F.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.