UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
The Shaughnessy Report: A Handy Look at Rules of Thumb
Elementary, Mr. Watson A Designer's Dilemma—Metric or Imperial Units?
Enabling Technology will Transform Hi-rel Electronics
November 7, 2022 | The Occam GroupEstimated reading time: Less than a minute
A Game-changing component assembly methodology will transform product confidence in the harshest environments.
The weakest link
Most electronic manufacturing defects are related to the soldering process and most field failures occur as a result of solder weaknesses such as fatigue due to shock and vibration and/or repeated thermal excursions in operations or rework.
The Occam Process is a game-changing solderless assembly technology that reorders the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing product size and cost. With Occam, solder-related failures are eliminated because solder itself is eliminated. The Occam approach bypasses the weakest link, inherently driving up product reliability while opening the door to a host of new capabilities and benefits for product designers.
Occam inventor Joe Fjelstad commented: “Occam isn’t just a new process but a reordering of current methods. It is an enabling technology allowing the industry to move toward a future where higher reliability, lower costs and less environmental impact are the norm. Occam will transform the industry into something substantially simpler and better.”
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