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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
April 28, 2025 | iNEMIEstimated reading time: 1 minute
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products. The overall project objective was to assess the surface mount processability and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards. To date, the project has:
Phase 1 — developed assembly processes on selected low-temperature solder pastes
Phase 2 — conducted mechanical shock reliability evaluation
Phase 3a — assessed the temperature cycling fatigue reliability of BGA solder joints of two different sizes with homogeneous and heterogeneous microstructures, under three distinct temperature cycling protocols
Phase 3b Now Forming — Sign Up by May 31
Phase 3b is being organized to:
Assess the temperature cycling fatigue reliability of near eutectic SnBi solder joints with the upper dwell temperature being > 0.95 homologous temperature for the SnBi alloy and compare this with Phase 3a results of three other temperature cycling protocols with upper dwell temperatures <0.95 homologous temperature.
Assess the temperature cycling fatigue reliability of LTS reverse hybrid solder joint for the standard 0-100ºC protocol and compare it with full SAC305 and full LTS SnBi solder joints.
Call-for-Participation Webinar
If you didn't have a chance to join us for the Session 1 call-for-participation webinar, you can still log in on April 28/29 for Session 2. This webinar will provide an overview of project accomplishments to date and introduce the plan for Phase 3b. The Phase 3b project is open for sign-up until May 31, 2025.
This webinar is open to industry; advance registration is required.
Please note: You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile.
Session 2
Tuesday, April 29, 2025
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on Monday, April 28
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Brent Fischthal - Koh YoungSuggested Items
Indium Corporation Experts to Present on Array of Solder and Thermal Management Solutions at APEX EXPO 2026
03/12/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX EXPO 2026, March 17-19, in Anaheim, California.
T-type Thermocouples in Foil Heater Technology
03/12/2026 | Zack Schaner, Flexible Circuit TechnologiesThis article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.
EpoxySet to Showcase Extensive line of Biocompatible Adhesives at MD&M West
12/09/2025 | epoxySetEpoxySet Inc. will be featuring the expanded line of adhesives, sealing, encapsulating and coating materials certified for biocompatibility at MD&M West on February 3-5, 2026, at the Anaheim Convention Center, Anaheim, CA, Booth 711.
Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.