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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
April 28, 2025 | iNEMIEstimated reading time: 1 minute
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products. The overall project objective was to assess the surface mount processability and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards. To date, the project has:
Phase 1 — developed assembly processes on selected low-temperature solder pastes
Phase 2 — conducted mechanical shock reliability evaluation
Phase 3a — assessed the temperature cycling fatigue reliability of BGA solder joints of two different sizes with homogeneous and heterogeneous microstructures, under three distinct temperature cycling protocols
Phase 3b Now Forming — Sign Up by May 31
Phase 3b is being organized to:
Assess the temperature cycling fatigue reliability of near eutectic SnBi solder joints with the upper dwell temperature being > 0.95 homologous temperature for the SnBi alloy and compare this with Phase 3a results of three other temperature cycling protocols with upper dwell temperatures <0.95 homologous temperature.
Assess the temperature cycling fatigue reliability of LTS reverse hybrid solder joint for the standard 0-100ºC protocol and compare it with full SAC305 and full LTS SnBi solder joints.
Call-for-Participation Webinar
If you didn't have a chance to join us for the Session 1 call-for-participation webinar, you can still log in on April 28/29 for Session 2. This webinar will provide an overview of project accomplishments to date and introduce the plan for Phase 3b. The Phase 3b project is open for sign-up until May 31, 2025.
This webinar is open to industry; advance registration is required.
Please note: You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile.
Session 2
Tuesday, April 29, 2025
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on Monday, April 28
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
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03/24/2026 | UnitempA new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.
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03/19/2026 | BUSINESS WIRESEEQC announced a significant breakthrough in the development of scalable, chip-based quantum computers, with results published in a peer-reviewed study in Nature Electronics.
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03/12/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX EXPO 2026, March 17-19, in Anaheim, California.
T-type Thermocouples in Foil Heater Technology
03/12/2026 | Zack Schaner, Flexible Circuit TechnologiesThis article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.