IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
November 9, 2022 | IPCEstimated reading time: 1 minute
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
The quarterly magazine will be offered in a digital format and will serve as a valuable new resource designed to keep the IPC global community up to date on the latest IPC news, including industry updates, trends and technology.
The digital edition will be made available the week of January 22, 2023, at IPC APEX EXPO. The magazine will receive bonus circulation with printed copies exclusively available at the show.
Inside “IPC Community,” readers will find feature stories that celebrate member success along with articles on advocacy efforts, committee and standards updates, education and workforce training developments, factory of the future solutions, advanced packaging updates emerging engineer and member profiles, and more.
“Our members and the broader global electronics manufacturing community look to IPC as a steadfast resource to keep them informed and educated on the latest industry developments,” said Brian Knier, IPC vice president, marketing, member success and sales. “We’re excited about the possibilities of “IPC
Community” taking our ability to disseminate timely and important information to the next level; all while making sure IPC members’ voices are reflected within the magazine.”
Added Michelle Te, “IPC Community” magazine managing editor, “Through its family of publications offering thought-provoking, original content, I-Connect007 prides itself ’in being ‘good for the industry.’ With the launch of ‘IPC Community,’ IPC and I-Connect007 are now even better for the industry. There is much to recognize and celebrate.”
To subscribe to “IPC Community,” visit www.ipc.org/subscribe-ipc-community. For inquiries regarding advertising opportunities within the magazine, contact Barb Hockaday, ad sales manager, at barb@iconnect007.com. To suggest a member success story, contact Michelle Te at michelle@iconnect007.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.