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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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Aismalibar to Exhibit at electronica 2022November 11, 2022 | Aismalibar
Estimated reading time: 1 minute
Aismalibar will exhibit at electronica 2022 November 15–18, 2022 in Munich, Germany. electronica is the world's leading trade fair and conference for electronics. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and “Thermal FR4” replacing “standard FR4” in Multilayers to reduce temperature of the electronic components on PCB.
Electronic developments increasingly require improved thermal dissipation and maintenance of good dielectric strength. Thermal management becomes more challenging on new PCB's design needs. At Aismalibar, we have been developing industry leading solutions to enhance the overall thermal performance of your electronic circuits.
The constant trend in electronic modules “More Power out of Shrinking Space” is massively increasing the heat generated by the electronic components used in the various Power Module applications. To ensure the specified Power Module performance over lifetime requires an intelligent heat management throughout the whole cooling chain of the Power Modules.
Aismalibar Thermal Interface Materials have been designed to improve dielectric isolation and fast thermal transmission in – for example – new high voltage battery systems (mobile and stationary), and electronic power modules, taking into consideration cost reduction, lifetime performance, safety, reliability, and recyclability.
Our Thermal Interface Materials are divided into two main areas, differentiated based on whether they need dielectric capacity. Dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation. Additionally, Aismalibar has developed a series of applicable surfaces on the TIMs, differentiated by either focus on optimizing Thermal Resistance (Rth) or to ease the use in users’ production by self-adhesiveness of the TIM. Aismalibar’s coatings can eliminate the use of thermal paste to reduce the air cavities, that exist between the surfaces of the TIMs and the heatsinks or electronic components.
COPPERFILLER and BOND SHEET CURED offer a high-performance alternative solution to current thermal pastes or pads. The new COBRITHERM ALP is made from an aluminum base that is dielectrically insulated, designed to build structures, covers, partitions or radiators, among other solutions. It is completely insulated and guarantees excellent contact between the battery and dissipation elements.
Visit us in Hall B1, Booth 543 to learn more. Our team will be pleased to meet with you and provide more information about our products.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.