-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Aismalibar to Exhibit at electronica 2022
November 11, 2022 | AismalibarEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/9116/9086/9835/news_adobestockfree_jul2022.jpeg)
Aismalibar will exhibit at electronica 2022 November 15–18, 2022 in Munich, Germany. electronica is the world's leading trade fair and conference for electronics. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and “Thermal FR4” replacing “standard FR4” in Multilayers to reduce temperature of the electronic components on PCB.
Electronic developments increasingly require improved thermal dissipation and maintenance of good dielectric strength. Thermal management becomes more challenging on new PCB's design needs. At Aismalibar, we have been developing industry leading solutions to enhance the overall thermal performance of your electronic circuits.
The constant trend in electronic modules “More Power out of Shrinking Space” is massively increasing the heat generated by the electronic components used in the various Power Module applications. To ensure the specified Power Module performance over lifetime requires an intelligent heat management throughout the whole cooling chain of the Power Modules.
Aismalibar Thermal Interface Materials have been designed to improve dielectric isolation and fast thermal transmission in – for example – new high voltage battery systems (mobile and stationary), and electronic power modules, taking into consideration cost reduction, lifetime performance, safety, reliability, and recyclability.
Our Thermal Interface Materials are divided into two main areas, differentiated based on whether they need dielectric capacity. Dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation. Additionally, Aismalibar has developed a series of applicable surfaces on the TIMs, differentiated by either focus on optimizing Thermal Resistance (Rth) or to ease the use in users’ production by self-adhesiveness of the TIM. Aismalibar’s coatings can eliminate the use of thermal paste to reduce the air cavities, that exist between the surfaces of the TIMs and the heatsinks or electronic components.
COPPERFILLER and BOND SHEET CURED offer a high-performance alternative solution to current thermal pastes or pads. The new COBRITHERM ALP is made from an aluminum base that is dielectrically insulated, designed to build structures, covers, partitions or radiators, among other solutions. It is completely insulated and guarantees excellent contact between the battery and dissipation elements.
Visit us in Hall B1, Booth 543 to learn more. Our team will be pleased to meet with you and provide more information about our products.
Suggested Items
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?