Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Nihon Superior Introduces Lead-Free Solder Paste for Automotive Requirements
November 14, 2022 | Nihon Superior Co. Ltd.Estimated reading time: 1 minute
Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions.
This balanced performance is achieved by using calibrated levels of the two key strengthening tools available in solder alloy formulation, stable dispersed particles combined with solid solution strengthening of the tin matrix.
With a liquidus temperature of 213°C LF-C2 can be reflowed at a lower temperature than SAC305 and has a higher shear strength than SAC305.
The completely halogen-free P608 flux medium delivers wetting comparable with that achieved with halogen-containing flux media. LF-C2 delivers excellent performance over a wide range of component types and process parameters.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.