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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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ITW EAE Introduces Auto Exit Wing Feature for Electrovert Wave Soldering Machines
November 15, 2022 | ITW EAEEstimated reading time: 1 minute
ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB ‘peels’ away from the solder which minimizes the opportunity for bridging defects to occur.
Electrovert’s Auto Exit Wing provides highly repeatable, precisely controlled exit wing adjustment that has been proven to deliver up to a 70% reduction in bridging defects and improved topside hole fill,” said Greg Calvo, ITW EAE Wave Soldering Business Manager. “Adjustments are made on-the-fly, eliminating the need for skilled labor to adjust the exit wing manually during product changeover.”
The Auto Exit Wing is activated by a recipe-controlled set-point to ensure optimal wave dynamics for every PCB type and application. Electrovert has built a high level of control and rapid change capability within the wave soldering process which provides great flexibility for lot-size-of-one capability in high-mix soldering applications. The system captures all data required for MES integration.
The Auto Exit Wing feature is fully compatible with all Electrovert UltraFill 4.0 and DwellMax 4.0 nozzles in both Air and N2 Tunnel environments and is field upgradeable.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.