Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Smart Automation: The Journey of a Component Through an SMT Factory
Powering the Future: Why Thermal Management Defines the Future of Electronics
PVA Develops New Valve Kiosk Stand for an Array of Applications
November 22, 2022 | PVAEstimated reading time: Less than a minute
PVA, a global supplier of automated dispensing and coating equipment, is pleased to introduce its new Valve Kiosk Stand for trade shows. The innovative stand boasts 18 valves from PVA’s extensive valve product line that satisfy an array of applications including dispensing, gasketing, conformal coating, thermal interface material, underfill, jetting and potting.
When it comes to electronics manufacturing technology, a one-size-fits-all mentality just doesn’t fit. That is why PVA combines it application expertise with innovative dispensing robotics and precision valve technology to deliver each client a custom-built solution that revolves around their needs.
The new Valve Kiosk Stand features three 15.6” touch screen interfaces with an interactive user interface. It includes removable valves for closer inspection and in-depth breakdowns of each valve: Overview, X-ray, Operation, Applications & Dispense Patterns. Customers can navigate by Industry, Application, Valve type or “Request Help,” if you are new.
Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner. PVA’s award-winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of the most demanding applications.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
05/01/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.