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TRI's New Multi-Camera 3D AOI at the IPC APEX EXPO 2023
November 24, 2022 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2023 held at San Diego Convention Center on January 24-26, 2023. Visit TRI at booth #2115 to experience the latest test and inspection innovations for the PCBA Industry.
TRI will unveil the newly released multiple-camera 3D AOI, TR7500QE Plus, which includes a high-speed top camera and four side-view cameras. The side view cameras allow the platform to inspect inner layer bridges, hidden lifted leads and other out-of-sight defects.
Additionally, visitors can experience the AI-powered 3D AOI, TR7700Q SII, with improved image quality at an industry-leading speed of up to 57 cm2/sec and unprecedented 1?m high-resolution inspection capability. The TR7700Q SII can deploy multiple 3D technologies to satisfy industry demands and enable virtually zero-escapes Inspection.
Furthermore, TRI plans to showcase the world-class 3D CT AXI for large boards TR7600F3D SII and TR7600LL SIII, and the award-winning series 3D SPI TR7007QI Plus. TRI's multi-core ICT TR5001Q SII INLINE will also be featured during the exhibition.
Discover why the leading EMS companies choose TRI as their Test and Inspection Partner. Visit us at IPC APEX EXPO 2023 booth #2115 for a personal demonstration of TRI's industry-leading One Stop Solution for PCB Assembly Testing and Inspection.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.