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TRI's New Multi-Camera 3D AOI at the IPC APEX EXPO 2023
November 24, 2022 | TRIEstimated reading time: 1 minute

Test Research, Inc. (TRI) will join the IPC APEX EXPO 2023 held at San Diego Convention Center on January 24-26, 2023. Visit TRI at booth #2115 to experience the latest test and inspection innovations for the PCBA Industry.
TRI will unveil the newly released multiple-camera 3D AOI, TR7500QE Plus, which includes a high-speed top camera and four side-view cameras. The side view cameras allow the platform to inspect inner layer bridges, hidden lifted leads and other out-of-sight defects.
Additionally, visitors can experience the AI-powered 3D AOI, TR7700Q SII, with improved image quality at an industry-leading speed of up to 57 cm2/sec and unprecedented 1?m high-resolution inspection capability. The TR7700Q SII can deploy multiple 3D technologies to satisfy industry demands and enable virtually zero-escapes Inspection.
Furthermore, TRI plans to showcase the world-class 3D CT AXI for large boards TR7600F3D SII and TR7600LL SIII, and the award-winning series 3D SPI TR7007QI Plus. TRI's multi-core ICT TR5001Q SII INLINE will also be featured during the exhibition.
Discover why the leading EMS companies choose TRI as their Test and Inspection Partner. Visit us at IPC APEX EXPO 2023 booth #2115 for a personal demonstration of TRI's industry-leading One Stop Solution for PCB Assembly Testing and Inspection.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Reflections and Priorities: An Update to I-Connect007 Readers
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The Knowledge Base: Building the Workforce of Tomorrow With EMAC
06/24/2025 | Mike Konrad -- Column: The Knowledge BaseAs the electronics manufacturing industry races to meet rising global demand and technological complexity, the need for a highly skilled, future-ready workforce has never been greater. At the forefront of addressing this challenge is The Electronics Manufacturing & Assembly Collaborative (EMAC)—a national initiative dedicated to strengthening the talent pipeline through strategic collaboration with SMTA, education, and government stakeholders.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.