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Cyient Strengthens Leadership at Cyient DLM to Expand its Manufacturing Business
November 25, 2022 | PRNewswireEstimated reading time: 1 minute
Cyient, a leading consulting-led, industry-centric global technology solutions company, announced that it has significantly strengthened the leadership of Cyient DLM in a bid to expand its Electronics Manufacturing Services (EMS) capabilities.
Cyient DLM focuses on high-reliability EMS offerings and has grown significantly over the last few years with a strong outlook for the future. The industry is witnessing a significant growth driven by changing global trends and a focus on key new technologies like IoT, Industry 4.0, etc. The advancement of the China Plus One strategy, increasing need for electronics manufacturing, significant focus on the Indian market, and opportunities in Built to Spec (B2S) are key global trends that present a unique opportunity to grow Cyient DLM business.
To accelerate this mandate, Cyient DLM is strengthening its leadership and has appointed a new Chief Executive Officer (CEO) and a Chief Operating Officer (COO).
Anthony Montalbano has joined Cyient DLM as the CEO and has more than three decades of experience in Engineering and Electronics Manufacturing Services in leadership roles with top global technology companies. He has led many global initiatives for business growth, including some of the largest transactions in the industry. His rich industry experience will enable the Cyient DLM business to accelerate growth.
Ram Dornala takes on the COO mantle at Cyient DLM. He has over two decades of experience in electronics design and manufacturing, having worked with leading manufacturers. In his most recent role, Ram led strategic initiatives like increasing global footprint and EMS capability and market adjacencies for Original Design Manufacturer (ODM). As the COO at Cyient DLM, Ram will work closely with Anthony to strengthen and expand DLM operations.
Commenting on the announcement, Krishna Bodanapu, MD and CEO of Cyient, said, "With a focus on highly complex, low-volume electronics manufacturing for safety-critical segments, DLM has a unique positioning in the market. With a strengthened leadership at Cyient DLM, I am confident that we are well-positioned to leverage the global trends to build strong growth momentum for the business. There are significant synergies between Cyient services and Cyient DLM's business, with a common set of customers and a potential to realize the B2S strategy. Cyient will continue to leverage these synergies to accelerate growth."
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10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.