Altus Reflects on its Success with ASSCON

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As PCBAs become more complex to manufacture with miniaturised components and different parts being mounted to the board, the soldering process becomes more difficult with the risk of structural damage, voids and defects. To support its customers in the challenge Altus Group, partnered with ASSCON vapour phase soldering systems who have the most innovative solutions for the production process.

Since partnering with ASSCON at the beginning of the year, Altus has seen huge interest in their vapour phase soldering systems in the UK and Europe with 2022 seeing an unprecedented uptick in new equipment sales.

Joe Booth, Altus Group CEO, said: “ASSCON is one of our newer suppliers who hold great credibility in the vapour phase world where they dominate locally and globally in terms of installations. This trend is set to continue into 2023 as customers look for the very best equipment in combination with an outstanding support service.

“ASSCON is constantly pushing the boundaries of technology and have been releasing new units which incorporate functionality which sets them above many other providers. What our customers really love is that they have a unit for every type of user, from small batch NPI series production, to the other extreme of 24/7 automotive production. This means that prospective users can select form several options and pricing levels, meaning there is a good ROI across most projects we encounter.

“When you think about the trends in the market of increased PCBA complexity, variation in thermal mass and the cost of energy, ASSCON starts to become a must have at most sites in our region.”

One of the most popular systems that has caught the attention of the industry is the new fully inline VP2100-100. Designed with a huge 750 x 620 mm soldering chamber that uses conveyor mechanisms rather than work piece carriers making it truly a hands off inline machine. Like other Asscon systems it uses an innovative oxygen-free process making it particularly energy efficient reducing power consumption by up to 70%.

Handling a wide range of batch sizes utilising the full 750mm by 620mm working area, it also ensures components including complex BGAs and QFPs are processed to the highest standard. This reduces voids of the highly complex assemblies used in the automotive and aero/military industries. Preheating and soldering is performed under exacting conditions so product overheating, component damage or PCB delamination cannot occur.