Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Aven Introduces Compact OptiVue LED Magnification Lamp
November 29, 2022 | AvenEstimated reading time: Less than a minute
Aven, a full-service technology provider, introduces the OptiVue 5-Diopter [2.25x] LED Magnification Desk Lamp. The OptiVue magnification lamp is compact enough to fit conveniently on a desk while being powerful and efficient in handling assembly, workshop or inspection applications.
Aven’s OptiVue LED Magnification Lamp is convenient, compact and versatile. It features a flexible 11" gooseneck arm 4", 5-diopter (2.25x magnification) crystal-clear round glass lens, 36 ultra-bright SMD LEDs, and a weighted base for added stability. Additionally, the OptiVue includes a removable fixing ring for easy lens replacement.
Aven has expanded its expertise in the realm of design and customized configuration of advanced video inspection systems. The company’s solution-based experts possess the ability to recommend and create complete optical systems according to customers’ needs and budgets.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
U.S. Army Begins Fielding BAE Systems’ Mission-critical Software-defined Radios Across Rotary-wing Aviation Fleet
09/08/2025 | BAE SystemsBAE Systems’ AN/ARC-231A Multi-mode Aviation Radio Set (MARS) has completed initial installation and is operationally ready for use today on select U.S. Army rotary-wing aircraft.