Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
Global Sourcing Spotlight: Building Long-term Supplier Relationships 
Standard of Excellence: Handling Difficult Customers With Grace and Professionalism
METCAL Announces Connection Validation Upgrade
November 30, 2022 | MetcalEstimated reading time: 1 minute
METCAL, a leader in benchtop soldering systems, announces firmware upgrade for their Connection Validation (CV) Series soldering systems.
The update further enhances the patented functionality of Connection Validation™ technology that gives real-time feedback on the quality of each solder joint as it is being made.
The latest CV firmware update also brings several new and improved CV features, including cartridge optimization capabilities, enhanced traceability, improved solder joint reliability, and more. This update is the result of years of research and input from process engineers, operators, customers, and industry experts, and promises to be a significant advancement in hand soldering.
“Connection Validation™ technology measures intermetallic compound formation during each solder event. The system alerts the operator at the exact moment a proper joint is created,” explains Hoa Nguyen, CTO of OK International, the parent company of Metcal. “Connection Validation™ remains the only way to truly verify the quality of a solder joint at the benchtop and is far superior to simple visual inspection.”
The updated software introduces CV Production Mode (Pcv), providing much faster feedback on intermetallic compound (IMC) formation, designed for more experienced operators, helping improve production efficiencies.
Additional soldering functionalities include modes for advanced process control, further maximizing the soldering efficiencies and optimized output.
To enhance the accuracy of the CV technology, Metcal has included in this upgrade a new Cartridge Optimization function. The system is now able to measure, store and use information about the exact electrical impedance of each soldering cartridge used, further improving the precision of the validation process.
Other new and improved features and functions include Approved Cartridge Lists, Tip Clean Reminder, Operator Login Functions, and Supervisor Lockout.
Metcal has spent the last several years gathering input from their engineers, customers, and industry experts to determine how to vastly improve Connection Validation. This next-generation of CV systems promises to be a significant advancement in hand soldering.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.
ESCATEC Installs Third Wave Soldering Machine in Penang to Meet Growing Demand
11/14/2025 | ESCATECESCATEC’s business unit in Penang, ESCATEC Electronics Sdn Bhd (EEM), recently welcomed the installation of an advanced Ersa POWERFLOW ULTRA wave soldering system, strengthening its capabilities and production capacity for customers bringing complex high-tech products to market.