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ZESTRON Launches New Product - VIGON SC 200 Stencil Cleaner Wipes
November 30, 2022 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce a new product to the market, VIGON® SC 200 Stencil Cleaner Wipes. A powerful combination of low-lint wiping material and effective stencil chemistry provides an efficient and safe alternative to alcohol-based cleaners.
VIGON® SC 200 Stencil Cleaner Wipes are designed to manually remove solder pastes and adhesives in electronic assembly manufacturing. Due to the water-based chemistry formulation, they provide exceptional cleanliness while ensuring operator safety. The polyester non-woven wipes offer excellent wet strength, reduce staining and lint left behind on your stencil, as well as increase cleaning protocol consistency. Compatible with nano-coated stencils, they are an ideal replacement for alcohol-based cleaners and are recommended for use in both manual and prior to automatic cleaning processes.
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Rachael Temple - AlltematedSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
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AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.