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Suggested Items

Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect

05/05/2026 | Michelle Te, I-Connect007
Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.

A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'

04/23/2026 | I-Connect007 Editorial Team
I-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time with… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.

Don’t Call It Ground, Call It Return

04/09/2026 | Kristin Moyer, Global Electronics Association
If you’ve studied electrical or computer engineering, or have just read an electronics schematic, circuit diagram, or other application notes, you've likely seen the term “Ground,” often abbreviated GND. This is used in school and during the teaching of electronics circuit analysis to indicate a reference or zero-voltage node for circuit analysis. It is also taught that there is no current in GND since the voltage is zero. These are assumptions made for the purpose of simplifying the introduction to circuit analysis.

Meet Emerging Engineer Logan Bistodeau, IBM

04/09/2026 | Michelle Te, I-Connect007
When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.

I-Connect007 Magazine: AI, Tolerances, Flexible Circuits, and More

03/17/2026 | I-Connect007 Editorial Team
In the spirit of March Madness, the latest issue of I-Connect007 Magazine tackles a full bracket of topics engineers face on real boards, from AI-powered design tools and cumulative tolerances to copper pours, etch factors, flexible circuits, and solder mask details.
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