Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
Momentus to Fly JINJUSat-1 for CONTEC Co.
December 5, 2022 | Business WireEstimated reading time: 1 minute
Momentus Inc., a U.S. commercial space company that offers transportation and other in-space infrastructure services, has signed a contract with CONTEC Co. of the Republic of Korea to provide space transportation services for the JINJUSat-1 CubeSat.
JINJUSat-1 is spearheaded by three entities: Jinju City, Korea Testing Laboratory, and Gyeongsang National University. The satellite is targeted to launch aboard the SpaceX Transporter-9 mission no earlier than October 2023. Once in orbit, cameras mounted on the satellite will carry out a mission to take pictures of the Earth.
“The Momentus team is looking forward to working with CONTEC Co. and supporting the growth of the South Korean space industry,” said Momentus Chief Executive Officer John Rood. “We have all witnessed the impressive growth of the South Korean economy, including in high-tech fields like electronics, aviation, and the automotive industry. The South Korean government aims to inspire, and foster participation in the space economy, and Momentus is eager to support this vision. Space transportation is a foundational building block to advancing the use of space, and we’re ready to provide the infrastructure services to enable CONTEC’s ambitions for the future.”
“CONTEC is excited to work with Momentus for the national space project. JINJUSat-1 is expected to foster the local space business and train experts in the space field. We are proud to take part in this project and to put their satellite into orbit,” said CONTEC Chief Executive Officer Sunghee Lee. “With its global network of ground stations, CONTEC is also discussing with the government to use the ground station capability to serve more national projects and contribute to the growth of the domestic space industry.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
AI Is the Golden Track Reviving Electronics and PCBs
08/06/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamRemember 2021? Despite COVID, the electronics industry hit a high. Then came the slide. By 2023, the industry was deep in the red. With inflation, policy shifts, and exchange rate shocks, the problems were long, and the outlook was bleak. Recovery finally appeared in 2024, but it was fragile. Automotive electronics slumped, wireless demand stayed soft, and the ride up was anything but smooth. Yet, amid the uncertainty, one bright track emerged: artificial intelligence (AI).
Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: The Interconnectedness of a Global Supply Chain
08/04/2025 | Nolan Johnson -- Column: Nolan's NotesYou may recall when I’ve discussed the research and development of a particular magazine issue topic and how, at times, I’ve pivoted at the last minute because of what I learned from the information I’ve gathered. This month, my original focus was on cultivating your brand, but the more I investigated the topic, the more my subject experts leaned toward international supply chain strategies. Not surprisingly, these two disparate topics are far more interrelated than they might seem.