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Transition Automation Introduces New Permalex S Series
December 8, 2022 | Transition Automation, Inc.Estimated reading time: 1 minute
Transition Automation, Inc. announces an expanded Permalex product line, with the introduction of the S series. This new product line is specifically designed for aqueous solder paste formulations, which have aggressive chemistries that are not compatible with the standard E series (Blue Spring Steel) version.
This new series is developed from a high grade of stainless steel that is harder than the stainless steel often used for stencils and squeegees. This product is ground sharp – polished at the edge – and coated with the Permalex Teflon metal matrix.
“We maintain all the aspects that make Permalex products highly durable for mission critical SMT printing. This way, customers are getting a nearly identical product, except this version can be used in highly alkaline paste chemistries as well as in high humidity and tropical environments,” states Mark Curtin, Technical Support Manager for Transition Automation.
The product shares many of the high-reliability aspects as the standard Permalex E series, including precision grind-polish-coat, laser part number and date code marking, and hermetically sealed, clean dust-free packaging. To order the Permalex S series, customers may simply change the common product code “E” (or “W”) to “S”.
Permalex S series is a stainless steel, high hardness and high yield strength alternative to Permalex E and is available immediately for any SMT printer platform. Permalex S may be ordered with Universal Holder Assemblies or as bare replacement blades, or blades with holes, and/or with bends for intrusive printing.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.