Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Transition Automation Introduces New Permalex S Series
December 8, 2022 | Transition Automation, Inc.Estimated reading time: 1 minute
Transition Automation, Inc. announces an expanded Permalex product line, with the introduction of the S series. This new product line is specifically designed for aqueous solder paste formulations, which have aggressive chemistries that are not compatible with the standard E series (Blue Spring Steel) version.
This new series is developed from a high grade of stainless steel that is harder than the stainless steel often used for stencils and squeegees. This product is ground sharp – polished at the edge – and coated with the Permalex Teflon metal matrix.
“We maintain all the aspects that make Permalex products highly durable for mission critical SMT printing. This way, customers are getting a nearly identical product, except this version can be used in highly alkaline paste chemistries as well as in high humidity and tropical environments,” states Mark Curtin, Technical Support Manager for Transition Automation.
The product shares many of the high-reliability aspects as the standard Permalex E series, including precision grind-polish-coat, laser part number and date code marking, and hermetically sealed, clean dust-free packaging. To order the Permalex S series, customers may simply change the common product code “E” (or “W”) to “S”.
Permalex S series is a stainless steel, high hardness and high yield strength alternative to Permalex E and is available immediately for any SMT printer platform. Permalex S may be ordered with Universal Holder Assemblies or as bare replacement blades, or blades with holes, and/or with bends for intrusive printing.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.