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PBT Works to Showcase PCB Cleaning Systems in Two Booths at APEX 2023
December 16, 2022 | PBT WorksEstimated reading time: 1 minute

PBT Works s.r.o., (in cooperation with MaRC Technologies) a leading manufacturer of cleaning technology for electronic assemblies and tooling, is pleased to announce plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase a SuperSWASH III and CompaCLEAN III in Booth #1205. Additionally, SMarTsol will showcase the HyperSWASH III high-end cleaning system and MiniSWASH III budget-friendly cleaning system in Booth #2123.
The SuperSWASH III is ideal for high-density SMD assemblies, as it is designed for customers looking for the best cleaning results without the need for automation or very high throughput. The system is ideal for medium to low quantities of complex products. SuperSWASH can be easily adjusted for cleaning any size and shape parts.
Designed for customers that prefer the traditional dishwasher style machine, CompaCLEAN III provides the type of cleaning many are accustomed to while minimizing the shadow effect, thanks to unique linear tangent spray technology. PCBs are loaded just like plates into a typical kitchen dishwasher. CompaCLEAN can be easily adjusted for cleaning any size and shape of parts by selecting various clamping solutions for bigger or smaller PCBAs and using a single or double basket setting.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.
Hannah Nelson: The Inspiring Journey of an Emerging Engineer
03/11/2025 | I-Connect007 Editorial TeamAt last year’s IPC APEX EXPO, former IPC Emerging Engineer Hannah Nelson had the opportunity to reflect on her inspiring journey into the world of engineering, from her education at Valparaiso University to her internship and her first job at Texas Instruments. From pivotal moments and the unexpected turns that helped shape her early career and passion for electrical engineering, her story highlights the importance of interdisciplinary collaboration, taking opportunities that arise early on, finding confidence in one's voice, and the rewards of pursuing one's passions within the engineering field.