Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Saki to Demonstrate 3D-AOI and 3D-AXI Live at 37th NEPCON JAPAN
December 20, 2022 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting its latest high-speed, premium accuracy in-line inspection solutions at the 37th NEPCON JAPAN in Tokyo, Japan. From January 25 - 27, visitors are invited to chat with the Saki team on Booth #15-1, East Hall 2, where Saki’s industry-leading inspection machines will be available for hands-on demonstrations. Booth highlights will include Saki’s 3D automated optical inspection equipment (3D-AOI) equipped with the latest optional functions and Saki’s innovative X-ray inspection solution (3D-AXI) that enables high-speed, high-precision in-line inspection for high-density mounting boards and ultra-small parts.
Saki’s booth will feature three 3D inspection machines, allowing booth visitors to experience the solutions up-close and gain an in-depth understanding of their performance directly from the Saki technical team at the show:
New 3D-AOI
3Di-LS3 and 3Di-MS3 – From Saki's new 3D-AOI 3Di series lineup, the 3Di-LS3 and 3Di-MS3 will be exhibited. The new 3Di series enables high-speed and high-performance inspection while achieving both high resolution and expanded height measurement with an upgraded high-resolution camera system. It offers a wide variety of features that can be selected according to the customer's production environment and product requirements. These optional functions enhance scalability and contribute to greater quality assurance and improved productivity. Equipped with an 8?m high-resolution camera system, the 3Di-LS3 supports assembly inspection of SMT-mounted parts, including extremely small and tall parts, with the industry's fastest cycle time. The 3Di-MS3 has a compact design suitable for medium size board inspection. It will be introduced at NEPCON JAPAN on the Saki booth together with the latest options that permit on-site upgrades.
3D-AXI
3Xi-M110 – with Saki’s optimized Planar CT software, developed in-house for incredible cycle-time improvements, this compact and lightweight 3D-AXI system provides impressive quality assurance with highly accurate void measurement and detection for both PCBs and components. It contributes to quality assurance with high-precision inspection by capturing solder joint defects and minute shape deformities in high-density circuit boards and components. Visitors to the Saki booth will personally witness the significant inspection speed enhancements the 3Xi-M110 provides, as well as being among the first to glimpse the exciting improvements of the latest M110 model.
Ken Katsumi, Chief Sales Manager of Saki's Sales Headquarter, said "Saki's high-quality in-line inspection technology, which realizes advanced automatic 100% inspection, is the perfect choice for customers who seek highest reliability, including those in the automotive industry. We will introduce the latest solutions that meet the quality requirements that our clients demand. We are looking forward to your visit."
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.