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TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

EV Solid-State Battery Validation Accelerates in the U.S. and Europe, Mass Production Expected to Gradually Begin by 2026

03/13/2025 | TrendForce
TrendForce’s latest research reveals that solid-state batteries are emerging as the next-generation battery technology with high commercial potential. Manufacturers across the U.S., Europe, and other global markets are accelerating large-scale production development and performance validation for automotive applications. 

Eltek Reports Full Year and Q4 2024 Financial Results

03/13/2025 | Eltek
Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US

03/12/2025 | AIM Solder
AIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
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