-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
KYOCERA AVX Joins IMC, Speeds IoT Go-to-Market for Adopters
December 22, 2022 | PRNewswireEstimated reading time: 1 minute

KYOCERA AVX, a manufacturer of antennas and RF chipsets, has joined the IoT M2M Council (IMC), the largest trade association dedicated to the nascent IoT sector. The company aims to improve speed-to-market for IoT adopters with a holistic approach to hardware and connectivity in product design. For its part, the IMC will provide the company with access to its rank-and-file membership of product makers and enterprise users that deploy IoT technology.
"We are pleased to join the IMC ecosystem, the largest and fastest-growing IoT/M2M organization in the world," says Carmen Redondo, KYOCERA AVX's director of global marketing for antennas, "IMC's membership profile is heavy with people creating products with connectivity, which suits us very well. Whether it is through standard hardware, customization, or pre-certification services, our objective is to improve the development cycle and provide superior connectivity."
Also of interest is the IMC's varied footprint, with membership all over the world and from 27 different vertical markets. KYOCERA AVX produces antennas that cover all major frequency bands, using a wide array of materials (from PCB to LDS and more) for embedded or external use. "We believe that our product line, combined with our online tools, reference designs with major RF module manufacturers, and experienced engineering teams around the world, can support any IoT application," says Redondo.
KYOCERA AVX will join the IMC's IoT Infrastructure Pavilion to exhibit at the Consumer Electronics Show next month, one of the very largest IoT events in the coming year (5-8 January 2023 in Las Vegas). The show attracts tens of thousands of attendees from crucial IoT sectors like automotive, health & wellness, smart home, and smart cities. As part of IoT Week @ CES, the IMC will also be producing conference programming and organizing networking and press events during the week, where Redondo will be participating.
Suggested Items
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
EV Solid-State Battery Validation Accelerates in the U.S. and Europe, Mass Production Expected to Gradually Begin by 2026
03/13/2025 | TrendForceTrendForce’s latest research reveals that solid-state batteries are emerging as the next-generation battery technology with high commercial potential. Manufacturers across the U.S., Europe, and other global markets are accelerating large-scale production development and performance validation for automotive applications.
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.