Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
EIPC Winter Conference: Lyon, France Power Plant Visit Registration Ends Today
January 3, 2023 | EIPCEstimated reading time: 1 minute
France is evocative of many things, amongst them some classics: their cuisine, their architecture, their music. In the latter category, who has not heard the timeless “Songs from the Auvergne” by Joseph Canteloube. Who has not been to Lyon in the Auvergne Region?
If you wish to be part of another classic event, then please consider joining the EIPC Winter Conference which is to be held over two days, Feb 9-10, 2023, the first in the famous Groupama Football Stadium in Lyon, wherein The Kopster Hotel will be our overnight stay venue; the second will be at the Bugey Nuclear Power Plant. In the evening of the first day, we shall be dining, rather well, downtown Lyon centre.
The conference will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, Doosan, KLA, ASS Luippold, Dyconex, Suss MicroTec, Showa Denko, NanYa, and others. We will also be having a roundtable for environmental matters e.g., REACH SVHC solder mask restrictions, involving companies such as Agfa, Electra Polymers, Notion Systems, SUSS MicroTec, Taiyo, and Parachem.
In announcing this now we are mindful of the need to complete our registration by Jan. 6, as we are restricted to only 96 delegates for the visit to the Bugey Nuclear Power Plant. Please come and join us at what will be another memorable EIPC Conference, and Lyon in the winter is sublime. As for the gastronomy, we will find out.
Deadline for registration for the power plant visit: January 3, 2023.
Maximum number of visitors to the power plant: 96
Please be aware that Conference Day 2 including visit ends at 4 p.m. Feb 10.
We need to receive a copy of the passport of all visitors to the Bugey Nuclear Power Plant before Jan 3, 2023.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.