Facing the Future: Successfully Navigating the Uncertain Path Ahead
It’s Only Common Sense: Going After the Small Wins Fosters a Winning Culture
The Chemical Connection: Surface Finishes for PCBs
iNEMI Call for Participation: Package Warpage Prediction Project
January 4, 2023 | iNEMIEstimated reading time: 1 minute
iNEMI is continuing a series of projects addressing package warpage challenges with Phase 6 of the Package Warpage Prediction and Characterization project. Packaging technology is aggressively evolving to meet new user demands and requirements. Understanding the dynamic warpage characteristics of electronic packages is critical for seamless board assembly.
iNEMI has completed five projects addressing warpage metrology challenges, measured and tracked recent trends in package warpage, and identified gaps in warpage simulation. While the previous projects focused on organic substrate packages, Phase 6 will focus on panel level packaging with inorganic material, such as glass substrate or carrier. The project will continue to:
- Conduct dynamic warpage characterization of the latest advanced packaging technologies from real samples to track trends and the typical range of warpage
- Establish a reliable modelling framework to optimize package dynamic warpage simulation
Join our call-for-participation webinar to learn more about the project and how it can benefit your organization.
Registration
This webinar is open to industry; advance registration is required, visit iNEMI's website. Deadline for project sign-up is February 13, 2023.
Tuesday, January 10, 2023
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (U.S.) on January 9
Tuesday, January 10, 2023
7:00-8:00 a.m. EST (U.S.)
1:00-2:00 p.m. CET (Europe)
8:00-9:00 p.m. CST (China)
Share on:
Suggested Items
DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications
04/08/2025 | RanovusCerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA), for the development of a state-of-the-art high-performance computing system. The Cerebras system will combine the power of Cerebras’ wafer scale technology and Ranovus’ wafer scale co-packaged optics to deliver several orders of magnitude better compute performance at a fraction of the power draw.
Altair, JetZero Join Forces to Propel Aerospace Innovation
03/26/2025 | AltairAltair, a global leader in computational intelligence, and JetZero, a company dedicated to developing the world’s first commercial blended wing airplane, have joined forces to drive next-generation aerospace innovation.
RTX's Raytheon Receives Follow-on Contract from U.S. Army for Advanced Defense Analysis Solution
03/25/2025 | RTXRaytheon, an RTX business, has been awarded a follow-on contract from the U.S. Army Futures Command, Futures and Concepts Center to continue to utilize its Rapid Campaign Analysis and Demonstration Environment, or RCADE, modeling and simulation capability.
Ansys to Integrate NVIDIA Omniverse
03/20/2025 | ANSYSAnsys announced it will offer advanced data processing and visualization capabilities, powered by integrations with NVIDIA Omniverse within select products, starting with Fluent and AVxcelerate Sensors.
Altair Releases Altair HyperWorks 2025
02/19/2025 | AltairAltair, a global leader in computational intelligence, is thrilled to announce the release of Altair® HyperWorks® 2025, a best-in-class design and simulation platform for solving the world's most complex engineering challenges.