-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
New Partnership for Taiyo Circuit Automation, Inc and Shur-Loc
January 6, 2023 | Taiyo Circuit AutomationEstimated reading time: 1 minute

Taiyo Circuit Automation announced a new partnership with Shur-Loc Fabric System. This partnership will combine Taiyo Circuit Automation world renown range of solder mask equipment with Shur-Loc’s unique screen making system.
The benefits of this unique system:
- Enables express replacement of damaged mesh
- No grinding of frames, no solvents or adhesives required
- Consistent / repeatable screen quality and tensioning
- Supplied pre angled in various mesh threads and counts for optimum printing quality.
“The Shur-loc system has been available in North America for many years and has built a strong following,” says Stuart Down, European Sales Manager at Taiyo America. “Taiyo are excited to bring this unique system to our customers in the UK and Europe to complement our Taiyo Circuit Automation equipment.”
“For years Shur-Loc has admired the superior quality and industry wide reliance on Circuit Automation’s equipment in the PCB market,” says David Larson, Vice President at Shur-Loc Fabric System. “Since the merger of Taiyo and Circuit Automation in 2020, they have become an increasing worldwide leader and driving force in the industry and one that Shur-Loc is excited and proud to be partnering with.”
Taiyo Circuit Automation, Inc. was established as a subsidiary of Taiyo America, Inc in 2020, in Carson City, NV. We design and manufacture the world’s finest dual-sided solder mask coating and vertical drying equipment. We have served the printed circuit industry with highly reliable innovative machinery, engineered to exceed expectations.
Shur-Loc Fabric Systems extensive experience in the textile and graphic screen-printing markets for over 30 years has led to the development of the most efficient and consistent PCB frame system available on the market today. Partnering with Taiyo Circuit Automation in the European market will not only give our valued customers ease of access to the best possible products but will also provide the reliable support that every customer deserves.
For more information visit https://taiyocircuitautomation.com.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.