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January 2023 Issue of Design007 Magazine Available Now
January 10, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

The Advanced Future
The year 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, and the IPC Advanced Packaging Symposium helped outline the hurdles we’re facing with complex packaging. So, we asked a variety of experts to discuss the challenges and trade-offs that PCB designers and design engineers are seeing today with advanced packages.
We start off this issue with an article by Kris Moyer, who focuses on the routing techniques necessitated by advanced packaging. Next, Lee Ritchey discusses a challenge that’s facing aerospace PCB designers who use stacked microvias, and he offers a variety of methods for circumventing this problem, including using staggered microvias. Columnist Tim Haag shares his take on designing complex packaging, and he tracks how complicated some designs have become over the past few decades. Ashutosh Mauskar breaks down the nearly “perfect storm” of drivers affecting the semiconductor industry and packaging trends, including supply chain issues, artificial intelligence, EVs and autonomous vehicles. And columnist John Watson explains why packaging is likely to continue shrinking and pushing Moore’s Law to its limits: “We are simply running out of room.”
We also have columns from our regular contributors Barry Olney, Matt Stevenson, Joe Fjelstad, Anaya Vardya, and Saskia Hogan. And we have articles from Zachariah Peterson and an interview with Ventec’s Alun Morgan and Mark Goodwin.
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Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.