Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
January 2023 Issue of Design007 Magazine Available Now
January 10, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
The Advanced Future
The year 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, and the IPC Advanced Packaging Symposium helped outline the hurdles we’re facing with complex packaging. So, we asked a variety of experts to discuss the challenges and trade-offs that PCB designers and design engineers are seeing today with advanced packages.
We start off this issue with an article by Kris Moyer, who focuses on the routing techniques necessitated by advanced packaging. Next, Lee Ritchey discusses a challenge that’s facing aerospace PCB designers who use stacked microvias, and he offers a variety of methods for circumventing this problem, including using staggered microvias. Columnist Tim Haag shares his take on designing complex packaging, and he tracks how complicated some designs have become over the past few decades. Ashutosh Mauskar breaks down the nearly “perfect storm” of drivers affecting the semiconductor industry and packaging trends, including supply chain issues, artificial intelligence, EVs and autonomous vehicles. And columnist John Watson explains why packaging is likely to continue shrinking and pushing Moore’s Law to its limits: “We are simply running out of room.”
We also have columns from our regular contributors Barry Olney, Matt Stevenson, Joe Fjelstad, Anaya Vardya, and Saskia Hogan. And we have articles from Zachariah Peterson and an interview with Ventec’s Alun Morgan and Mark Goodwin.
Share on:
Suggested Items
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
RTX's Collins Aerospace to Provide UK Chinook Helicopters with Interoperable Avionics System
11/12/2024 | RTXCollins Aerospace, an RTX business, has received a $19 million contract from the Department of Defense to equip a fleet of new H-47 Chinooks for the UK Royal Air Force with its Common Avionics Architecture System (CAAS) avionics management suite.
Lockheed Martin Skunk Works, the Royal Netherlands Aerospace Centre (NLR) Announce Strategic Collaboration
10/21/2024 | Lockheed MartinSkunk Works®, the renowned advanced development organization within Lockheed Martin Corporation and the Royal Netherlands Aerospace Centre (NLR), a premier knowledge institute and connecting link among science, industry, and government in the Netherlands, announced a strategic collaboration to advance mutual interests for enhanced security at the Netherlands Defense Industry Days event.
Altair Drives Aerospace Innovation at Motivo
10/17/2024 | AltairAltair, a global leader in computational intelligence, is proud to announce its collaboration with Motivo, a product engineering firm focused on translating forward-thinking visions into best-in-class products for clients in the mobility, energy, agriculture technology, and aerospace sectors. Motivo utilizes Altair’s unique combination of engineering consulting and software to drive innovation for organizations in the aerospace industry.
Airbus, Toshiba to Partner on Superconductivity Research
10/16/2024 | AirbusAirbus UpNext, a wholly-owned subsidiary of Airbus, and Toshiba Energy Systems & Solutions Corporation (Toshiba), Toshiba Group’s energy arm, will cooperate and mutualise experience on superconducting technologies for future hydrogen-powered aircraft.