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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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January 2023 Issue of Design007 Magazine Available NowJanuary 10, 2023 | Andy Shaughnessy, Design007 Magazine
Estimated reading time: 1 minute
The Advanced Future
The year 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, and the IPC Advanced Packaging Symposium helped outline the hurdles we’re facing with complex packaging. So, we asked a variety of experts to discuss the challenges and trade-offs that PCB designers and design engineers are seeing today with advanced packages.
We start off this issue with an article by Kris Moyer, who focuses on the routing techniques necessitated by advanced packaging. Next, Lee Ritchey discusses a challenge that’s facing aerospace PCB designers who use stacked microvias, and he offers a variety of methods for circumventing this problem, including using staggered microvias. Columnist Tim Haag shares his take on designing complex packaging, and he tracks how complicated some designs have become over the past few decades. Ashutosh Mauskar breaks down the nearly “perfect storm” of drivers affecting the semiconductor industry and packaging trends, including supply chain issues, artificial intelligence, EVs and autonomous vehicles. And columnist John Watson explains why packaging is likely to continue shrinking and pushing Moore’s Law to its limits: “We are simply running out of room.”
We also have columns from our regular contributors Barry Olney, Matt Stevenson, Joe Fjelstad, Anaya Vardya, and Saskia Hogan. And we have articles from Zachariah Peterson and an interview with Ventec’s Alun Morgan and Mark Goodwin.
Collins Aerospace, an RTX business, has been selected by Air India for a full suite of avionics hardware catering to the airline's expanding Boeing 737 MAX fleet.
Further to the announcement of 17 August 2023, BAE Systems has now received the necessary regulatory approvals and will be executing steps in the coming days to complete the acquisition of Ball Aerospace from Ball Corporation.
With such an extremely newsy week, it was hard to select just five items you absolutely must read, but here goes. We have advocacy news from PCBAA and IPC, global market data on AI PC and GenAI smartphone hardware, a roundtable discussion on sales and marketing, a bookended pair of international milaero stories emphasizing a healthy aerospace industry, and an industry report on global semiconductor sales.
Honeywell announced it will invest $84 million to expand its Olathe manufacturing facility in Kansas. The project, which is expected to generate nearly $47 million in total gross domestic product (GDP) and contribute $18.3 million to state and local taxes in the first six years, supports the company's alignment with the compelling megatrend of the future of aviation.
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards.