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Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

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Solving the Toughest BGA Challenges in Electronics

07/30/2025 | Nash Bell, BEST Inc.
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.

Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia

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Target Condition: The 5 Ws of PCB Design Constraints

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Have you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.

From Attraction to Action: Where Marketing Ends and Sales Begins

07/29/2025 | Brittany Martin, I-Connect007
Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.

Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability

07/25/2025 | Calumet Electronics
Calumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.
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