Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities

11/20/2024 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.

Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024

11/19/2024 | Yamaha Robotics SMT Section
Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.

RTX's Raytheon Awarded U.S. Army Contract for Wireless Power Beaming Technology

11/18/2024 | Raytheon Technologies
Raytheon, an RTX, has been awarded a contract from the U.S. Army to work on directed energy wireless power beaming capabilities that will distribute power across the battlefield, simplify logistics, and safeguard locations for U.S. troops.

Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology

11/14/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the bipartisan CHIPS and Science Act. This investment will enable the company to leverage its intellectual property and experience of developing semiconductor technologies that serve important end markets, such as communications and the defense industrial base, while also creating over 400 direct manufacturing and construction jobs.

Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software

11/13/2024 | Siemens
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in