Facing the Future: Successfully Navigating the Uncertain Path Ahead
It’s Only Common Sense: Going After the Small Wins Fosters a Winning Culture
The Chemical Connection: Surface Finishes for PCBs
Ventec Launches Highest Thermal Conductive Metal Base Laminate for IGBT & Power Markets
January 16, 2023 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd. is pleased to announce the launch of its latest high thermal conductive metal base laminate VT-4BC designed for use in applications requiring excellent performance in thermal management including super bright lighting, power modules, controllers, motor drives and rectifiers.
With high electrical breakdown strength, VT-4BC is designed to provide unparalleled reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.
In addition to its exceptional thermal performance, VT-4BC also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is also resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications particularly for IGBT and power markets.
The material will make its US debut at IPC APEX Expo 2023 from 24-26 January in San Diego, where visitors to booth 419 can discover the superior performance of VT-4BC alongside the full range of PCB base materials.
Ventec’s Global Head IMS Technology, Chris Hanson commented on the release of VT-4BC: “We are proud to introduce a product that provides unparalleled thermal performance and highest electrical breakdown strength. VT-4BC is designed for customers who value reliability and require improved performance over traditional materials. We look forward to showcasing it at IPC APEX Expo in January, where attendees can discover its superior capabilities firsthand.”
Share on:
Suggested Items
IPC President’s Award: Dr. Thomas Marktscheffel
04/15/2025 | Nolan Johnson, I-Connect007At ASMPT SMT Solutions, Thomas Marktscheffel, director of product management software solutions, is responsible for the SMT line software portfolio. As a member and leader of several IPC committees, he is also a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852, which make it possible to provide plug-and-play connectivity for intelligent SMT Factories. In 2015, he participated in the IPC-1782 A-team and subsequently joined the IPC-2591 CFX standard A-team, which became the new SMT industry communication standard following its first release in March 2019.
BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations
04/15/2025 | BEST Inc.BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host multiple Soldering 101 workshops in its Rolling Meadows, Illinois and Lansing, Michigan locations.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
HT Pho-Tronics Appoints Ankit B. Goti as New General Manager to Drive Strategic Growth
04/14/2025 | HT Pho-TronicsHT Pho-Tronics, a leading provider of high-reliability printed circuit boards (PCBs), proudly announces the appointment of Ankit B. Goti as the company’s new General Manager, effective immediately.
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO: