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Cost-Effective AOI from Mek (Marantz Electronics) at APEX 2023
January 16, 2023 | Mek (Marantz Electronics)Estimated reading time: 1 minute
Mek will be part of North America’s largest gathering of electronics manufacturing professionals later this month – the IPC APEX EXPO 2023, at San Diego Convention Center on January 24th – 26th, 2023. They will be showcasing their latest AOI technology on booth #1539.
Mek will be exhibiting the VeriSpector THT assembly station AOI, a low-cost assembly station AOI for use on manual and semi-automated SMD and THT assembly lines. Featuring an overhead orthogonal camera and LED lighting system the VeriSpector is designed for a wide verity of inspection needs.
Initially, available as a manual inspection system, VeriSpector is now available as both an in-line system and as a modular system for self-integration. These new developments allow manufacturers to easily integrate the VeriSpector Assembly Station AOI into their existing production lines, giving them even more control and flexibility in their inspection processes.
Also at the show, visitors can experience the powerful PowerSpector benchtop AOI featuring the latest generation 5MP USB 3 Vision Cameras. The PowerSpector AOI systems offer selective 3D imaging of components with side cameras integrated in the 3D processing. The systems are suitable for use in pre-reflow, post-reflow, post-wave and post-selective soldering, and can also be used for 2D solder paste inspection and first article inspection.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.