Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Koh Young America Strengthens Sales Channel with Technimark
January 16, 2023 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces a new relationship with Technimark for technical sales representation across Illinois and Eastern Wisconsin. Based in Cary, Illinois and backed by nearly 40-years serving the electronics, cable & wire harness, and light industrial market segments, they – like Koh Young – are focused on exceeding customer expectations. Effective immediately, Technimark adds Koh Young to its portfolio of industry-leading partners including Panasonic Connect printers and mounters.
“We are excited to become part of the Koh Young sales team. It is a tremendous brand to bring under our banner. Their award-winning service team supports best-in-class inspection solutions, and when combined with our expertise, we will help manufacturers in all the markets we serve improve their processes,” commented Rich Syphers, President at Technimark. “As we continue our evolution from a materials distributor to a full-scale solutions provider, Koh Young will bolster our offerings and further expand our footprint for the next 40 years.”
Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with solder paste, surface mount components, through-hole, machined parts, press-fit pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and commands the dominant global market share position in the SPI and AOI markets with over 20,000 installations.
“We are incredibly pleased Technimark has joined the Koh Young America team,” commented Allen Phung, Sales Manager at Koh Young America. “The team at Technimark will bring the experience, energy, and commitment necessary to help us continue breaking performance records and, more importantly, elevate customer service.”
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.