-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nordson Test & Inspection to Demonstrate Best-in-Class Inspection and Metrology Systems at APEX 2023
January 16, 2023 | Nordson Test & InspectionEstimated reading time: 1 minute
Nordson Test & Inspection announced that it will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will highlight the multi-award-winning CyberOptics SQ3000™+ Multi-Function system for AOI, SPI and CMM, the M2 AOI system, the CyberOptics SE3000™ SPI system and Quadra 7 X-ray system in Booth #915.
The CyberOptics SQ3000+ all-in-one solution for AOI, SPI and CMM offers a combination of unmatched high accuracy and high speed, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that inhibits reflection-based distortions caused by shiny components and specular surfaces. The system is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT, 008004/0201 SPI, socket metrology and other challenging CMM applications.
The M2 AOI system offers high-speed inspection and exceptional defect coverage with advanced megapixel technology. With high resolution and telecentric optics, the M2 provides complete inspection for wire bonds, die placement, SMT components and substrates.
The new Dual-Mode MRS sensor in the CyberOptics SE3000™ SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed inspection and another mode for high resolution inspection. The new sensor is an extension of the proprietary MRS sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. The SE3000 is ideal for measuring height, area, volume, registration and bridging, as well as detecting insufficient paste, excess height, smear, offset and more.
The company will also showcase the Quadra 7 X-ray system. At the cutting edge of X-ray inspection performance, Quadra 7 shows features and defects as small as 0.1µm non-destructively, with the ultimate image quality and magnification. Ideal for root cause failure, wire bond integrity checking, component cracking, MEMs inspection and wafer level components including TSV and wafer bumps. Quadra 7 is the X-ray inspection and failure analysis tool of choice in a wide range of industries, including electronics packaging and wafer level manufacturing, automotive, energy and aerospace electronics inspection, and medical device and LED fabrication.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.