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Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX EXPO 2023
January 18, 2023 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation will be exhibiting in booth #409 at IPC APEX EXPO in San Diego, CA Jan. 24–26, highlighting some of its next-generation high-performance circuit materials.
Visitors to Rogers’ booth will learn about:
Kappa® 438 Laminates Now Available in 10 Mil
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low-cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. Standard thicknesses include 10, 20, 30, 40 and 60 mil.
COOLSPAN® Thermally & Electrically Conductive Adhesive:
COOLSPAN TECA is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards and has a storage life of up to 12 months from date of manufacture. COOLSPAN films provide a convenient and reliable approach to bond high power circuit boards, heavy metal back-planes, heat sink coins and RF module housings. This approach overcomes voiding and flow issues that are problematic for sweat soldering and dispensed adhesive approaches. COOLSPAN TECA films can be tack soldered in a fixture, ensuring accurate registration. This is followed by a tooled thermal cure or PCB press cycle.
Rogers and Fortify to jointly promote 3D Printing Technology:
On January 16, 2023, Rogers Corporation and 3D Fortify Inc. (“Fortify) announced they entered into an expanded agreement to jointly promote Rogers’ 3D printable materials and Fortify’s additive manufacturing equipment. This agreement reinforces the continued commitment to develop electronic applications using the unique capabilities provided by high performance materials such as Rogers’ Radix™ printable RF materials and Fortify’s FLUX Series DLP printers.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
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Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
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Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.