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Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX EXPO 2023
January 18, 2023 | Rogers CorporationEstimated reading time: 1 minute

Rogers Corporation will be exhibiting in booth #409 at IPC APEX EXPO in San Diego, CA Jan. 24–26, highlighting some of its next-generation high-performance circuit materials.
Visitors to Rogers’ booth will learn about:
Kappa® 438 Laminates Now Available in 10 Mil
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low-cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. Standard thicknesses include 10, 20, 30, 40 and 60 mil.
COOLSPAN® Thermally & Electrically Conductive Adhesive:
COOLSPAN TECA is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards and has a storage life of up to 12 months from date of manufacture. COOLSPAN films provide a convenient and reliable approach to bond high power circuit boards, heavy metal back-planes, heat sink coins and RF module housings. This approach overcomes voiding and flow issues that are problematic for sweat soldering and dispensed adhesive approaches. COOLSPAN TECA films can be tack soldered in a fixture, ensuring accurate registration. This is followed by a tooled thermal cure or PCB press cycle.
Rogers and Fortify to jointly promote 3D Printing Technology:
On January 16, 2023, Rogers Corporation and 3D Fortify Inc. (“Fortify) announced they entered into an expanded agreement to jointly promote Rogers’ 3D printable materials and Fortify’s additive manufacturing equipment. This agreement reinforces the continued commitment to develop electronic applications using the unique capabilities provided by high performance materials such as Rogers’ Radix™ printable RF materials and Fortify’s FLUX Series DLP printers.
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Rachael Temple - AlltematedSuggested Items
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.