Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Universal Instruments Highlights Precision Automation Solutions at IPC APEX EXPO 2023
January 19, 2023 | Universal InstrumentsEstimated reading time: 1 minute
Universal Instruments will feature its Precision Automation solutions on Booth 1749 at the 2023 IPC APEX EXPO, held at the San Diego Convention Center on January 24–26. On the booth, Universal will showcase its Uflex® modular automation platform and IQ360™ Factory Software Suite. Uflex is the ultimate flexible multi-process assembly cell, eliminating the need for hard-tooled systems. Universal’s IQ360 software suite integrates all facets of factory operations for optimal productivity.
Uflex accommodates an array of process modules, as well as a wide variety of feeding options to perform virtually any automation task. It supports up to four independent process modules on a single gantry, including vacuum or pneumatic placement, screw driving, UV curing, or dispensing. This unique architecture offers investment protection versus single-task custom cells and can lower the cost per insertion by more than 95% versus manual assembly processes while improving quality and yield.
The IQ360 Software Suite is a full complement of smart factory modules designed to control, monitor and improve production efficiency. Comprised of Design & NPI, Material Management, Production Control, and Monitoring & Analytics modules, IQ360 offers individual capability bundles that meet specific factory requirements, providing a true “connected factory” production environment.
“Automating can be challenging for even a single product, but our customers need automation solutions that can adapt from one complex product to another,” noted Universal Instruments Vice President of Marketing, Glenn Farris. “Many of these products enlist a multitude of processes, such as high-accuracy alignment, flex handling, cutting and forming, inspection, and bonding. These precision automation applications are where we deliver the most value by leveraging our automation experience and breadth of technologies.” Farris added, “These applications are proliferating across markets including server/network infrastructure, IoT, high-reliability industrial, medical, mil-aero, mobility and automotive.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.