-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki Adds Ultra-High-Speed 3D AXI Solution to In-Line X-ray PCB Inspection Range
January 19, 2023 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces the addition of a new 3D X-ray Automated Inspection System (3D-AXI) to its popular 3Xi-M110 range, bringing further improvements in cycle time and inspection accuracy. The newly developed 3Xi-M110 V3 delivers an impressive 50% cycle-time reduction and the highest accuracy volumetric inspection results on the market today.
Building on the previous enhancements released in 2022, Saki starts the new year with further optimizations to its 3D automated X-ray range. The need for premium printed circuit board and component inspection has grown year-on-year. Saki stands at the forefront of the essential technology required for automated quality assurance with its 3Xi-M110 V3 heading the Saki Total Inspection Line Solution, delivering the cutting-edge results manufacturers strive for.
At the core of the machines’ upgrades is the exclusive Planar CT technology and a suite of tools that are custom developed in-house to optimize the inspection of PCBs of every type. The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is unparalleled, ensuring cleaner results untarnished by shadows or noise.
Saki’s Planar CT technology used in the 3Xi-M110 detects solder joint defects and microstructure abnormalities in high-density PCBs. The automated X-ray inspection system utilizes Real 3D volumetric inspection to clearly identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component parts based on fillet position and other factors.
The 3Xi-M110 V3 maintains the same light weight and compact footprint as the original 3Xi-M110 while consuming 40% less power per board, which underlines Saki’s commitment to contributing to sustainable manufacturing with Saki's latest inspection solutions.
Saki will debut the 3Xi-M110 V3 machine at the 37th NEPCON JAPAN, which will be held at Tokyo Big Sight on January 25-27. Visitors to the show are invited to Saki's booth (East Hall 2, Booth No. 15-1) for a demonstration and to discover Saki's latest solutions for the ever-changing inspection environment.
Norihiro Koike, President and CEO of Saki Corporation said: “The 3Xi-M110 V3 model has merged hardware and software optimization to achieve speeds that are twice as fast as the previous model and to help improve manufacturing quality thanks to Saki's proprietary planar CT technology for X-ray inspection. Saki will continue to advance its technology to ensure highest maintainability, manufacturing efficiency and economic viability. For 2023, we look forward to further develop and deepen our relationships with our global customer base and business partners.”
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.