The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Saki Adds Ultra-High-Speed 3D AXI Solution to In-Line X-ray PCB Inspection Range
January 19, 2023 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces the addition of a new 3D X-ray Automated Inspection System (3D-AXI) to its popular 3Xi-M110 range, bringing further improvements in cycle time and inspection accuracy. The newly developed 3Xi-M110 V3 delivers an impressive 50% cycle-time reduction and the highest accuracy volumetric inspection results on the market today.
Building on the previous enhancements released in 2022, Saki starts the new year with further optimizations to its 3D automated X-ray range. The need for premium printed circuit board and component inspection has grown year-on-year. Saki stands at the forefront of the essential technology required for automated quality assurance with its 3Xi-M110 V3 heading the Saki Total Inspection Line Solution, delivering the cutting-edge results manufacturers strive for.
At the core of the machines’ upgrades is the exclusive Planar CT technology and a suite of tools that are custom developed in-house to optimize the inspection of PCBs of every type. The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is unparalleled, ensuring cleaner results untarnished by shadows or noise.
Saki’s Planar CT technology used in the 3Xi-M110 detects solder joint defects and microstructure abnormalities in high-density PCBs. The automated X-ray inspection system utilizes Real 3D volumetric inspection to clearly identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component parts based on fillet position and other factors.
The 3Xi-M110 V3 maintains the same light weight and compact footprint as the original 3Xi-M110 while consuming 40% less power per board, which underlines Saki’s commitment to contributing to sustainable manufacturing with Saki's latest inspection solutions.
Saki will debut the 3Xi-M110 V3 machine at the 37th NEPCON JAPAN, which will be held at Tokyo Big Sight on January 25-27. Visitors to the show are invited to Saki's booth (East Hall 2, Booth No. 15-1) for a demonstration and to discover Saki's latest solutions for the ever-changing inspection environment.
Norihiro Koike, President and CEO of Saki Corporation said: “The 3Xi-M110 V3 model has merged hardware and software optimization to achieve speeds that are twice as fast as the previous model and to help improve manufacturing quality thanks to Saki's proprietary planar CT technology for X-ray inspection. Saki will continue to advance its technology to ensure highest maintainability, manufacturing efficiency and economic viability. For 2023, we look forward to further develop and deepen our relationships with our global customer base and business partners.”
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.