-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Three Industry Leaders Receive IPC President’s Award
January 26, 2023 | IPCEstimated reading time: 2 minutes
In recognition of their leadership and their significant contributions of time and talent to IPC and the electronics manufacturing industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in San Diego, Calif on January 24, 2023. Recipients were Steven Bowles, Lockheed Martin; Stan Rak, SF Rak Company; and Savita Ganjigatti, Sienna ECAD Technologies Private Limited.
Steven Bowles is a member of more than 30 standards development committees, holding leadership roles as Chair of 3-10 Printed Board Base Materials, D-13 Flexible Circuits Base Materials, D-15 Flexible Circuits Test Methods, and D-11 Flexible Circuits Design. He is the Chair Emeritus of 2-30 Terms and Definitions Committee. Bowles is also a member of the Committee Chairman’s Council and a Lifetime Member of IPC’s Technical Activities Executive Committee (TAEC). He is a member of the Lead-Free Electronics Risk Management, (PERM) Council, a Mentor in IPC’s Emerging Engineer Program, and was the very first recipient of IPC’s Rising Star Award in 2015. Winner of many committee leadership and committee service awards, Bowles also serves as an IPC standards committee A-Team leader.
Stan Rak is the chair of the IPC APEX EXPO 2023 Technical Program Committee (TPC) where he has served for six Technical Conferences in different roles, working closely with IPC staff and industry experts on program development. Developments include the expansion and strengthening of the TPC, the introduction of Special Sessions designed to stimulate audience participation in emerging fields and assisting with the transition to a digital document format for improved communications with authors. Rak has contributed to the inaugural releases of the standards, IPC-5262, IPC J-STD-001GA/IPC-A-610GA, and IPC-7093. He received the IPC Rising Star Award in 2016 for IPC-related contributions to the automotive electronics manufacturing industry.
Savita Ganjigatti has been involved in the industry for more than 30 years, and served as a steering committee member for the IPC 2022 Global Design Competition, representing the Asia Pacific region. A program panel member of the IPC Global Thought Leadership Program, she has also serves on the IPC India Technical Advisory Committee, was instrumental in starting the PCB competition in that region, and conducted many design contests. Ganjigatti was a critical in the development of the Women in India Electronics group, paper presentations, and standards reviews facilitated by IPC India. She helped to implement “PCB Design Engineering” as an elective at several Indian universities, and she is actively involved in skill development initiatives of the Indian central government.
“The leadership and expertise of Steven, Stan, and Savita sets the standard for building electronics better,” said John W. Mitchell, IPC president and CEO. “By presenting them with IPC President’s Awards, we are showing our appreciation for their significant contributions to IPC and the global electronics manufacturing industry.”
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, test and advanced packaging. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.
Suggested Items
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
11/15/2024 | Keysight TechnologiesKeysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).
Neways Partners with MilDef for the Production of Advanced Electronic Components
11/15/2024 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, connectivity and smart mobility companies, announces it has entered into a partnership with MilDef, the developer of world-leading tactical IT solutions, products and systems, made to perform in the toughest conditions.