-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Introduces New Committee Leader and Committee Volunteer Awards at IPC APEX EXPO 2023
February 8, 2023 | IPCEstimated reading time: 1 minute
In keeping with its commitment to showing appreciation for its strong volunteer community, IPC introduced two new awards in IPC standards development at IPC APEX EXPO 2023. The awards, Committee Leader of the Year and Volunteer of the Year, were named in honor of key leaders and volunteers from IPC standards development efforts. The Hillman-Lambert Award, named for IPC Hall of Famers and longtime standards committee volunteers David Hillman and Leo Lambert, is awarded to volunteers of the year. The Goldman-Kessler Award, named for IPC Hall of Famers, and longtime committee leaders, Patty Goldman and Bernie Kessler, is awarded to leaders of the year.
Nominations for the 2023 awards were open to all volunteers and leaders whose groups had completed their standards projects between October 2021 and October 2022. The awards were peer-selected, and a nomination committee was formed to review and judge all nomination packets.
The Hillman-Lambert Award was presented to Michael Ford, Aegis Software, and Christina Rutherford, Honeywell International, as the result of a tie vote. Ford received his nomination for his work with the 2-12c Cybersecurity Protection Standard Task Group. Rutherford was nominated for her work with the 7-31f IPC/WHMA-A-620 Task Group.
The Goldman-Kessler Award was presented to Bob Cooke, NASA Johnson Space Center. Cooke was nominated for his leadership of the 7-31k Wire Harness Design Task Group and the 5-24g Polymerics Standard Task Group.
In addition to Ford and Rutherford, nominees for the Hillman-Lambert Award included Erika Crandall, TE Connectivity; Hermann Eicher, EPT Guglhoer GmbH; Joseph Kane, BAE Systems; Garry McGuire, NASA Marshall Space Flight Center; Zhiqian Sang, Hangzhou Dianzi University; and Wei Wang, New HC3 Technologies Co., Ltd.
In addition to Cooke, nominees for the Goldman-Kessler Award were: Scott Bowles, Lockheed Martin; Constantino Gonzalez, Acme Training and Consulting; Thomas Marktscheffel, ASMPT GmbH & Co. KG; and Victor Xu, Huawei Technologies Co., Ltd.
“Volunteerism is the bedrock of our standards development activities,” said Teresa Rowe, IPC senior director, assembly and standards technology. “The new standards development committee awards program is entirely volunteer-driven, created to recognize the best-of-the-best in our standards development activities.”
Committee Leader and Volunteer of the Year awards will be presented on an annual basis, with next presentation taking place at IPC APEX EXPO 2024 in Anaheim, California.
Suggested Items
Hot Off the Press: Explore the New Issue of IPC Community
01/14/2025 | IPC Community Editorial TeamThe latest digital copy of IPC Community, is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members. Find stories on IPC student leadership, successful women in business, the trouble with tariffs, the inside workings on an IPC mentorship duo, standards updates, and so much more.
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.
TRI Launches 3D AXI Platform with Clearer Imaging
01/10/2025 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600FB SII system, designed to deliver clearer imaging.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
Marcy LaRont Named I-Connect007 Executive Director
01/08/2025 | IPCMarcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.