Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Solder Recovery Expert EVS International Enters 20th Year
February 16, 2023 | EVS InternationalEstimated reading time: 1 minute
EVS International, a leader in solder recovery, is pleased to announce its 20-year anniversary. The company attributes its contribution to reducing the carbon footprint and providing a rapid ROI as the main drivers of its success over the past 20 years.
EVS International develops and manufactures environmentally friendly and innovative solutions to address the production of dross created by all wave solder machines. The EVS range of environmentally friendly Solder Recovery Systems enhances its customers’ ISO 14001 credentials by recovering pure solder from dross, therefore reducing their carbon footprint. The company has won more than 25 international awards, including best product, best environmental product, and most innovative product.
“EVS is proud of its 20 years in the business and over these 20 years our customers have saved millions of dollars in solder and helped reduce waste, which is good for the environment,” stated Simon Norman, Business Director. “Solder prices are at an all-time high and EVS is going from strength to strength developing new machines to recover solder and save our customers money.”
EVS International works closely with its customers so that a complete understanding of manufacturing requirements results in a support service tailored to shop floor requirements. Being number one in its market segment gives EVS an advantageous insight into its customers’ need of fast ROI and user-friendly operation.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.