-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Vitronics Soltec Introduces Centurion+ for High Solder Paste Reflow Applications
February 17, 2023 | Vitronics SoltecEstimated reading time: 1 minute
Vitronics Soltec is releasing a new reflow soldering oven that addresses the unique challenges facing high solder paste customers. The new Centurion+ is a robust upgrade to the proven Centurion with unique features that further minimize maintenance and keep the process chamber cleaner.
In applications that require a high amount of solder paste, the amount of maintenance required increases. To address this challenge the Centurion+ features greater accessibility to components that require maintenance. Easily removable blow boxes with removable side plates make cleaning easier in the cooling area. Easily removable baffle boxes on infeed and outfeed reduces downtime for cleaning.
Centurion+ can be configured with Ultra CATHOX to handle more than 50kg of solder paste per week. The patented CATHOX™ (Catalytic Thermal Oxidizer) dramatically reduces maintenance requirements while keeping a clean process environment. It is very effective in removing volatile compounds from the process tunnel during reflow. In thermal oxidation, organic vapors are converted to hydrocarbons, which are captured by a filter. The design also ensures that when maintenance is required, you have easy access and can do the maintenance job with few tools required.
“We designed the Centurion+ with considerable input from our customers to make sure we were addressing all of their needs,” said Coco Zhang, ITW EAE Reflow Business Manager. “We have a strong relationship with the world’s leading manufacturers and work directly with them to identify areas that need further innovation.”
With the best heat transfer in the industry, the Centurion is able to run any profile at the lowest set point possible, which minimizes the thermal differences over the product and uses less energy. Superior process control ensures repeatability across the oven for consistently higher yields. A reliable and robust design ensures high uptime even with the toughest reflow requirements.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.