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Foxconn Partners With Scrappers to Present Their 2023 Season
February 20, 2023 | FoxconnEstimated reading time: 1 minute
Hon Hai Technology Group has partnered with the Mahoning Valley Scrappers to present their 2023 season. This major partnership will provide Foxconn with a significant season-long presence with the Scrappers through community engagement and hospitality. Foxconn will sponsor five unique team specialty jersey nights with jersey proceeds benefiting local community organizations. Foxconn will also sponsor the weekly “Every Sunday Matters” promotion which gives back to local charities every Scrappers Sunday home game.
Foxconn Technology Group states, “Foxconn is proud to partner with the Mahoning Valley Scrappers for the 2023 MLB Draft League Season. Foxconn is looking forward to another great season from the Mahoning Valley Scrappers and we pride ourselves on the communities in which we operate. We look forward to enjoying America’s past time with thousands of those who call the Mahoning Valley home and who visit the Mahoning Valley.“
Jordan Taylor, Executive Vice President of HWS Baseball said, “I am so pleased to have Foxconn as our presenting sponsor this season. A partnership between two organizations celebrating 25 years in the valley and a company helping shape the future of the valley promotes pride in our past and excitement for things to come.”
“Foxconn’s partnership with the Mahoning Valley Scrappers is just a start to how we will work tirelessly to support the local community through jobs, investment, and opportunities for all those who call the Mahoning Valley home.”, Foxconn Technology Group said.
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Brent Fischthal - Koh YoungSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.