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Advanced Electronics Packaging Digest

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Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Infineon Showcases AI-Era Technologies at electronica 2026

10/14/2026 | Infineon
With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever.

Infleqtion UK to Develop Deployable Quantum RF Direction-Finding System

10/13/2026 | BUSINESS WIRE
Infleqtion, a global leader in quantum computing and quantum sensing powered by neutral-atom technology, has been awarded £9 million (~$12M) by Innovate UK, part of UK Research and Innovation (UKRI), to continue development of a deployable quantum radio frequency (QRF) direction finding (DF) system as part of the Quantum Missions Primer programme.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.

I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next

10/09/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part On the Line With… Qnity podcast series exploring the materials, technologies, and engineering challenges shaping the future of electronics. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.
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