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Pemtron Will Discuss Leading 3D SPI, AOI, CCI & More at the SMTA Dallas Expo & Tech Forum
February 27, 2023 | Pemtron TechnologyEstimated reading time: 1 minute
Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce plans to exhibit at the SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 28, 2023 at the Plano Event Center in Texas.
Steven Wongsonvanee, Pemtron General Manager – Americas, will be available to meet with customers to discuss its Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System, TROI 8800 CI Series Conformal Coating Inspection System and Mercury Automated X-ray SMD Counter.
The Athena 3D Automated Optical Inspection (AOI) System uses 12-way projection for 3D measurements on all models to minimize errors due to shadow effects, and performs 100 percent of 2D & 3D inspection concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. The system offers 10/15 or 18um resolution, a 10MP camera (optional 12MP) and a three-stage conveyor.
Also on the AOI side, Pemtron offers the TWIN 3D AOI system for top/bottom double-sided simultaneous inspection. Pemtron’s new head type has been upgraded for 3D formation that is identical to the real image and is more stable.
Pemtron’s Saturn 3D Inline Solder Paste Inspection (SPI) System features Moiré technology, combining 2D color images with 3D measurement data. The result is more accurate and realistic 3D inspection images unlike conventional methods that display the solder paste through a color map only. With quad projection, 10/15 or 18um resolution a 4MP camera (optional 10MP) and three-stage conveyor (rail extensions optional), the Saturn is the most advanced 3D SPI system.
Pemtron’s TROI 8800 CI Series Conformal Coating Inspection System with optional inline Coating Thickness Measure provides the most reliable conformal coating inspection. With simple programming, the machine can inspect defects like cracks, coating voids, wrong coating thickness (too-thin or too-thick).
The Mercury Automated X-ray SMD Counter provides real-time data with Artificial Intelligence. The system offers a reel capacity of up to four 7” reels or a single 13” reel, a scanner and label printer interface, real-time ERP reporting and annual stock through barcode monitoring.
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IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.