-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Two Indium Corporation Experts to Participate at IMAPS Device Packaging Conference
March 1, 2023 | Indium CorporationEstimated reading time: 2 minutes

The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session.
Payne’s presentation, scheduled for 10:30–11 a.m. on Thursday, March 16, is titled “Processing and Reliability Testing of a Copper Pressure Sinter Paste for Use in High Power Module, Die-Attach Applications.” Power electronics are evolving to meet the high demands of new and emerging applications, such as e-Mobility/vehicle electrification. Pressure sintered silver is fast becoming the material of choice for die-attach due to the favorable material properties and proven reliability. This presentation will introduce a copper sinter paste that can achieve consistently high shear strengths (~40MPa) when sintered with 15–20MPa of pressure. The impact of process conditions will be examined, plus reliability testing.
In addition, Dr. Mackie has been tapped to chair a special lunch session, “Words Matter: Clarity in Terminology Around Advanced Packaging is Needed Now More Than Ever.” As the ubiquity of semiconductor chips in our daily lives has become increasingly apparent, the interconnection and protection of the semiconductor chip (IPSC, also known as “Packaging”) is also starting to enter the public consciousness. In order to enable clear communication to everyone—from layperson to senior engineer—the session will address the proliferation of sometimes confusing and overlapping terminologies (MCM, heterogeneous integration, advanced packaging, advanced assembly, and so on), how to differentiate these terms from each other, and what is necessitated for clear communications to all stakeholders.
Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Payne holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.