Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Meet Henry Crandall: New IPC Student Board Member
March 5, 2023 | Barry Matties, I-Connect007Estimated reading time: 1 minute
Barry Matties sits down with Henry Crandall, the newly minted Student Board Member on the IPC Board of Directors, to talk about how Henry became the first PhD student in electrical engineering in his family, as well as how his role on the IPC Board will allow him to represent the voices of students and young professionals interested in shaping the future of both IPC and the industry.
Barry Matties: Henry, congratulations, you are now the Student Board Member at IPC. Tell us, what does it take to become a student board member?
Crandall: There’s a small application process. You send in some materials about your background, qualifications, and your resume. Then there’s a couple of short questions to answer about why you might be a good fit, what you would contribute, etc. This year, they also asked us to film a short video introducing ourselves and explaining why we should be the next student board member.
Matties: What was your motivation in pursuing this role?
Crandall: I’ve been involved with IPC for a couple of years; I was part of the founding group that put a student chapter at my university. Someone from the IPC Education Foundation brought this opportunity to my attention. They told me I’d be a really great fit and that I should check it out.
We’ve been in close touch with (IPCEF Senior Director) Charlene (Gunter du Plessis) ever since. This is my first year at APEX EXPO, too. It’s been awesome so far.
Matties: That’s great. Tell us about what you’re doing, your studies, and what you hope to accomplish in your career.
Crandall: I did my undergrad in electrical engineering, and now I’m pursuing a PhD in the same field, but with a different flavor. Now I’m in a more biomedical-facing field. My research is currently focused on electromagnetism and biology. In general, I’m trying to come up with novel algorithms and methods to monitor health through wearable devices.
To read this entire conversation, which appeared in the 2023 issue of Show & Tell Magazine, click here.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.