Rehm Thermal Systems to Exhibit at productronica China

Estimated reading time: 3 minutes

When productronica China opens its doors once more in Shanghai from 13 to 15 April 2023, Rehm Thermal Systems – an expert in thermal system solutions and active on the Chinese market for over 15 years – will also be presenting the highlights of its latest product portfolio. As the leading platform for innovative electronics production, the international trade fair is one of the most important events of its kind throughout the entire Asian region.

At the company stand in Hall N4, Stand Number 4518 of the Shanghai New International Expo Centre (SNIEC), Rehm will be presenting the VisionXP+ convection soldering system with vacuum chamber, the Condenso condensation soldering system, the Nexus contact soldering system and the Protecto dispensing and coating system this year.

The convection soldering systems belonging to the Vision series are efficient, powerful and – depending on the respective version – suitable for different batch sizes in the automotive, consumer electronics or power electronics sectors. The VXP+ with vacuum chamber, which Rehm will be exhibiting at productronica, is the “best-in-class” reflow convection soldering system from the manufacturer based in the southern German town of Blaubeuren, and is not only characterised by increased process stability, but also greater energy efficiency, reduced emissions and operating costs, all thanks to integrated EC motors. A separate vacuum module enables convection soldering processes with negative pressure in just one process: Pores, gas pockets and voids are reliably removed directly after the soldering process. There is no need for the assembly’s time-consuming processing by an external vacuum system; instead, the workpieces are transferred from the peak zones directly into the vacuum process. The high-end system also offers effective residue management by means of pyrolysis in the preheating zone, as well as minimal downtimes, low maintenance and intelligent traceability solutions.

In reflow condensation soldering or vapour phase soldering, the soldering process is carried out with the aid of hot steam. As the heat transfer is up to ten times higher than with convection soldering, the Condenso systems brought to you by Rehm are particularly suitable for large or high-mass boards. The systems of the Condenso series can be integrated into the most diverse production environments with the highest degree of process reliability – be it batch operation, inline connection or soldering in a continuous process. A vacuum option for void-free soldering also enables series production in power electronics. The system series highlights also include the patented injection process, which makes the soldering process individually controllable, or the control of the reflow profile reproducible – and thus ensures better control of the condensation phase.

With the Nexus contact soldering system, Rehm, in turn, promises the best results through reflow soldering processes with contact heat under vacuum. Suitable areas of application can be found in advanced packaging, and especially in the fields of power electronics, semiconductors and wafer technology, which are increasingly being used for railway operations, wind turbines, battery storage and, last but not least, in the automotive industry. Due to its minimal dimensions and high degree of user-friendliness, the system is particularly suitable for use in small to medium series production, and in the laboratory sector.

Optimal coating processes for high-quality electronics are available with the Protecto series from Rehm. The dispensing and coating systems protect electronic assemblies from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration, and deliver safe, automated processes, as well as precise results in the application of a wide range of materials. Up to four simultaneously usable applicators give their users numerous options: In addition to dispensing, these include the ability to create freely definable, three-dimensional housing shapes by simple application, the immediate curing of UV varnishes and the casting or bonding of different materials.

With ViCON, Rehm offers a software solution for all systems being presented at productronica China. Tailored to a wide range of manufacturing processes, the plant software delivers an impressive performance with its intuitive operation, optimal process control, convenient product management and smooth connection to higher-level manufacturing management systems (MES).